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dc.date.accessioned2019-02-26T22:24:05Zen
dc.date.available2019-02-26T22:24:05Zen
dc.date.issued2018-10-23en
dc.identifier.urihttp://hdl.handle.net/10919/87852en
dc.description.abstractA low profile inductor structure suitable for use in a high power density power converter has one or more windings formed by vias through a thin, generally planar body of magnetic material forming the inductor core and conductive cladding on the body of magnetic material or material covering the magnetic material body. Variation of inductance with load current and other operational or environmental parameters is reduced to any desired degree by forming a slot that removes all or a portion of the magnetic material between the locations of the vias.en
dc.format.mimetypeapplication/pdfen
dc.language.isoen_USen
dc.publisherUnited States Patent and Trademark Officeen
dc.titleLow profile coupled inductor substrate with transient speed improvementen
dc.typePatenten
dc.contributor.departmentElectrical and Computer Engineeringen
dc.contributor.departmentCenter for Power Electronics Systems (CPES)en
dc.identifier.urlhttp://pimg-fpiw.uspto.gov/fdd/04/094/101/0.pdfen
dc.date.accessed2019-02-15en
dc.type.dcmitypeTexten
dc.contributor.assigneeVirginia Tech Intellectual Properties, Inc.en
dc.contributor.inventorLi, Qiangen
dc.contributor.inventorLee, Fred C.en
dc.contributor.inventorSu, Yipengen
dc.contributor.inventorHou, Dongbinen
dc.date.filed2015-12-02en
dc.identifier.applicationnumber14956948en
dc.subject.cpcH01F1/14en
dc.subject.cpcH01F3/14en
dc.subject.cpcH01F17/0033en
dc.subject.cpcH01F2017/002en
dc.subject.cpcH02M3/155en
dc.subject.cpcH05K1/0373en
dc.subject.cpcH05K1/0233en
dc.subject.cpcH05K1/165en
dc.subject.cpcH05K2201/0209en
dc.subject.cpcH05K2201/0245en
dc.subject.cpcH05K2201/086en
dc.subject.cpcH05K2201/10015en
dc.type.patenttypeutilityen
dc.identifier.patentnumber10109404en


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