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dc.contributor.authorKishore, Ravi Ananten
dc.contributor.authorNozariasbmarz, Aminen
dc.contributor.authorPoudel, Beden
dc.contributor.authorSanghadasa, Mohanen
dc.contributor.authorPriya, Shashanken
dc.date.accessioned2019-07-30T16:43:01Zen
dc.date.available2019-07-30T16:43:01Zen
dc.date.issued2019-04-16en
dc.identifier.issn2041-1723en
dc.identifier.other1765en
dc.identifier.urihttp://hdl.handle.net/10919/92048en
dc.description.abstractThermoelectric coolers are attracting significant attention for replacing age-old cooling and refrigeration devices. Localized cooling by wearable thermoelectric coolers will decrease the usage of traditional systems, thereby reducing global warming and providing savings on energy costs. Since human skin as well as ambient air is a poor conductor of heat, wearable thermoelectric coolers operate under huge thermally resistive environment. The external thermal resistances greatly influence thermoelectric material behavior, device design, and device performance, which presents a fundamental challenge in achieving high efficiency for on-body applications. Here, we examine the combined effect of heat source/sink thermal resistances and thermoelectric material properties on thermoelectric cooler performance. Efficient thermoelectric coolers demonstrated here can cool the human skin up to 8.2 degrees C below the ambient temperature (170% higher cooling than commercial modules). Cost-benefit analysis shows that cooling over material volume for our optimized thermoelectric cooler is 500% higher than that of the commercial modules.en
dc.description.sponsorshipDARPA MATRIX program (NETS)en
dc.description.sponsorshipICTAS Doctoral Scholars Programen
dc.description.sponsorshipArmy Research Office (ARO) through DARPA TE3 programen
dc.description.sponsorshipNational Science Foundationen
dc.language.isoenen
dc.publisherSpringer Natureen
dc.rightsCreative Commons Attribution 4.0 Internationalen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.titleUltra-high performance wearable thermoelectric coolers with less materialsen
dc.typeArticle - Refereeden
dc.description.notesThe authors (R.A.K. and S.P.) gratefully acknowledge the financial support from DARPA MATRIX program (NETS). R.A.K. acknowledges the financial support from ICTAS Doctoral Scholars Program. A.N. would like to acknowledge the financial support through Army Research Office (ARO) through DARPA TE3 program. B.P. acknowledges the financial support from National Science Foundation.en
dc.title.serialNature Communicationsen
dc.identifier.doihttps://doi.org/10.1038/s41467-019-09707-8en
dc.identifier.volume10en
dc.type.dcmitypeTexten
dc.type.dcmitypeStillImageen
dc.identifier.pmid30992438en


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Creative Commons Attribution 4.0 International
License: Creative Commons Attribution 4.0 International