Assembly Yield Model for Area Array Packages
This research work led to the development of a mathematical model that can incorporate variability in the package, board and assembly related parameters and construction of an effective methodology to predict the assembly yield of area array packages. The assembly yield predictions of the model are based on the characteristics of input variables (whether they follow a normal, empirical or experimental distribution). By incorporating the tail portion of the parameter distribution (up to Â±6 standard deviation on normal distribution), a higher level of accuracy in assembly yield prediction is achieved. An estimation of the interaction of parameters is obtained in terms of the expected number of defective joints and/or components and a degree of variability around this expected value. As an implementation of the mathematical model, a computer program is developed. The software is user friendly and prompts the user for information on the input variables, it predicts the yield as expected number of defective joints per million and expected number of defective components (assemblies) per million. The software can also be used to predict the number of defects for a user-specified number of components (less or more than one million assemblies).
The area array assembly yield model can be used to determine the impact of process parameter variations on assembly yields. The model can also be used to assess the manufacturability of a new design, represent the capability of an assembly line for bench marking purposes, help modify designs for better yield, and to define the minimum acceptable manufacturability standards and tolerances for components, boards and designs.
- Masters Theses