As hydrogel products are manufactured and used for applications ranging from biomedical to agricultural, it is useful to characterize their behavior and interaction with other materials. This thesis investigates the adhesion between two different solvated semi-interpenetrating polymer network (S-IPN) silicone hydrogels and a cyclo-olefin (COP) polymer through experimental, analytical, and numerical methods.

Interfacial fracture data was collected through the application of the wedge test, a relatively simple test allowing for the measurement of fracture properties over time in environments of interest. In this case, the test was performed at discrete temperatures within range of 4Ë C to 80Ë C. Two COP adherends were bonded together by a layer of one of the S-IPN silicone hydrogels. Upon the insertion of a wedge between the two adherends, debonding at one of the two interfaces would initiate and propagate at a decreasing rate. Measurements were taken of the debond length over time and applied to develop crack propagation rate versus strain energy release rate (SERR) curves. The SERR values were determined through the application of an analytical model derived for the wedge test geometry and to take into account the effects of the hydrogel interlayer. The time-temperature superposition principle (TTSP) was applied to the crack propagation rate versus SERR curves by shifting the crack propagation rates with the Williams-Landel-Ferry (WLF) equation-based shift factors developed for the bulk behavior of each hydrogel. The application of TTSP broadened the SERR and crack propagation rate ranges and presented a large dependency of the adhesion of the system on the viscoelastic nature of the hydrogels. Power-law fits were applied to the master curves in order to determine parameters that could describe the adhesion of the system and be applied in the development of a finite element model representing the interfacial fracture that occurs for each system. The finite element models were used to validate the analytical model and represent the adhesion of the system such that it could be applied to future geometries of interest in which the S-IPN silicone hydrogels are adhered to the COP substrate.

[Files modified per J. Austin, July 9, 2013 Gmc]