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dc.contributor.authorPang, Ying-Fengen_US
dc.date.accessioned2002-09-11en_US
dc.date.accessioned2014-03-14T20:44:57Z
dc.date.available2014-03-14T20:44:57Z
dc.date.issued2002-08-26en_US
dc.identifier.otheretd-09082002-125724en_US
dc.identifier.urihttp://hdl.handle.net/10919/34965
dc.description.abstractThermal management is one of many critical tasks in the design of power electronic systems. It has become increasingly important as a result of the introduction of high power density and integrated modules. It has also been realized that higher temperatures do affect reliability due to a variety of physical failure mechanisms that involve thermal stresses and material degradation. Therefore, it is important to consider temperature as design parameter in developing power electronic modules. The NSF Center for Power Electronics System (CPES) at Virginia Tech previously developed a first generation (Gen-I) active Integrated Power Electronics Module (IPEM). This module represents CPES's approach to design a standard power electronic module with low labor and material costs and improved reliability compared to industrial Intelligent Power Modules (IPM). A preliminary Generation II (Gen-II.A) active IPEM was built using embedded power technology, which removes the wire bonds from the Gen-I IPEM. In this module, the three primary heat-generating devices are placed on a direct bonded copper substrate in a multi-chip module format. The overall goal of this research effort was to optimize the thermal performance of this Gen-II.A IPEM. To achieve this goal, a detailed three-dimensional active IPEM was modeled using the thermal-fluid analysis program ESC in I-DEAS to study the thermal performance of the Gen-II.A IPEM. Several design variables including the ceramic material, the ceramic thickness, and the thickness of the heat spreader were modeled to optimize IPEM geometric design and to improve the thermal performance while reducing the footprint. Input variables such as power loss and interface material thicknesses were studied in a sensitivity and uncertainty analysis. Other design constraints such as electrical design and packaging technology were also considered in the thermal optimization of the design. A new active IPEM design named Gen-II.C was achieved with reduced-size and improved thermal and electrical performance. The success of the new design will enable the replacement of discrete components in a front-end DC/DC converter by this standard module with the best thermal and electrical performance. Future improvements can be achieved by replacing the current silicon chip with a higher thermal-conductivity material, such as silicon carbide, as the power density increases, and by, exploring other possible cooling techniques.en_US
dc.publisherVirginia Techen_US
dc.relation.haspartThesis_Pang.pdfen_US
dc.rightsI hereby certify that, if appropriate, I have obtained and attached hereto a written permission statement from the owner(s) of each third party copyrighted matter to be included in my thesis, dissertation, or project report, allowing distribution as specified below. I certify that the version I submitted is the same as that approved by my advisory committee. I hereby grant to Virginia Tech or its agents the non-exclusive license to archive and make accessible, under the conditions specified below, my thesis, dissertation, or project report in whole or in part in all forms of media, now or hereafter known. I retain all other ownership rights to the copyright of the thesis, dissertation or project report. I also retain the right to use in future works (such as articles or books) all or part of this thesis, dissertation, or project report.en_US
dc.subjectpower electronics coolingen_US
dc.subjectintegrated design optimizationsen_US
dc.subjectthermal managementen_US
dc.titleIntegrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)en_US
dc.typeThesisen_US
dc.contributor.departmentMechanical Engineeringen_US
thesis.degree.nameMaster of Scienceen_US
thesis.degree.levelmastersen_US
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen_US
dc.contributor.committeechairScott, Elaine P.en_US
dc.contributor.committeememberBohn, Jan Helgeen_US
dc.identifier.sourceurlhttp://scholar.lib.vt.edu/theses/available/etd-09082002-125724/en_US
dc.contributor.committeecochairThole, Karen A.en_US
dc.date.sdate2002-09-08en_US
dc.date.rdate2003-09-11


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