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dc.contributor.authorFinlayson, Eric F.en_US
dc.date.accessioned2014-03-14T20:50:57Z
dc.date.available2014-03-14T20:50:57Z
dc.date.issued1998-02-06en_US
dc.identifier.otheretd-12598-10640en_US
dc.identifier.urihttp://hdl.handle.net/10919/36504
dc.description.abstractStress-freezing photoelastic experiments are conducted using two different sets of photoelastic materials to investigate stress intensity behavior near to and coincident with bimaterial interfaces. Homogeneous, bonded homogeneous, and bonded bimaterial single edge-cracked tension specimens are utilized throughout the investigation for comparative purposes. The first series of tests involves machined cracks obliquely inclined to the direction of far field tensile loading. Mixed-mode stress intensity factors are observed and quantified using a simplified analytical algorithm which makes use of experimentally measured data. In this series of tests, the bimaterial specimens consist of a photoelastic material bonded to the same material containing a moderate quantity of aluminum powder (for elastic stiffening purposes). Moderate yet similar increases in stress intensity factors are observed in bonded homogeneous and bonded bimaterial specimens, suggesting the presence of bondline residual stresses (rather than elastic modulus mismatch) as the primary contributing factor. The second series of tests involves the bonding of mutually translucent photoelastic materials whose elastic module differ by a ratio of approximately four to one. Cracks are placed both near and coincident to the bimaterial interfaces. Mode-mixity and increases in stress intensity are found only in bimaterial specimens whose cracks are placed close to the bondline. Using the materials from the first series of tests it is shown that the increases in these near-bondline experiments are due to thermal mismatch properties (incurred during the stress freezing cycles) rather than mechanical mismatch properties.en_US
dc.publisherVirginia Techen_US
dc.relation.haspartThesis.pdfen_US
dc.rightsI hereby grant to Virginia Tech or its agents the right to archive and to make available my thesis or dissertation in whole or in part in the University Libraries in all forms of media, now or hereafter known. I retain all proprietary rights, such as patent rights. I also retain the right to use in future works (such as articles or books) all or part of this thesis or dissertation.en_US
dc.subjectfractureen_US
dc.subjectmode-mixityen_US
dc.subjectinterfaceen_US
dc.titleStress Intensity Factor Distributions in Bimaterial Systems - A Three Dimensional Photoelastic Investigationen_US
dc.typeThesisen_US
dc.contributor.departmentEngineering Mechanicsen_US
dc.description.degreeMaster of Scienceen_US
thesis.degree.nameMaster of Scienceen_US
thesis.degree.levelmastersen_US
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen_US
thesis.degree.disciplineEngineering Mechanicsen_US
dc.contributor.committeechairSmith, Charles W.en_US
dc.contributor.committeememberLandgraf, Ronald W.en_US
dc.contributor.committeememberDillard, David A.en_US
dc.identifier.sourceurlhttp://scholar.lib.vt.edu/theses/available/etd-12598-10640/en_US
dc.date.sdate1998-02-06en_US
dc.date.rdate1998-02-27
dc.date.adate1998-02-27en_US


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