Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
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- Doctoral Dissertations 
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The effect of process conditions, time, temperature, and rates of temperature rise, on the exhaustion of disperse dye on polyester yarn under high-temperature dyeing conditions Zamani, Fereshteh (Virginia Polytechnic Institute and State University, 1984)
Fundamental aspects of the tribological behavior of poly(ether-ether-ketone)-based in-situ composites at elevated temperatures Hanchi, Jorge (Virginia Tech, 1995-05-05)
In-situ composites based on self-reinforcing blends of engineering thermoplastics and thermotropic liquid crystalline polymers (TLCPs) are recently developed, innovative polymeric materials, which have been reported to ...