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dc.contributor.authorFerro, John Francisen_US
dc.date.accessioned2014-03-14T21:29:43Z
dc.date.available2014-03-14T21:29:43Z
dc.date.issued1991-05-05en_US
dc.identifier.otheretd-02162010-020032en_US
dc.identifier.urihttp://hdl.handle.net/10919/41140
dc.description.abstract

The goal of this project was to design an airborne radio frequency circuit card that was very light weight, occupied a small volume, and operated from 20 Mhz to 1500 Mhz. The circuit card being reported on is called an RF multicoupler, and is one of two cards used in a radio frequency distribution unit (RFD). This unit interfaces a large number of receivers to various antennas.

In the past this type of circuitry was done by cascading discrete connectorized RF components together with coaxial cable. As technology progressed the discrete surface mount or pin through RF components were mounted on single layer fiberglass or Duroid circuit cards. The next generation improved circuit density by incorporating a multilayer RF circuit card in which RF and digital control signals were run on the internal layers.

The RF multilayer circuit card in this project represents the state-of-the-art for high density RF circuitry. The board material is a teflon/fiberglass composite. The discrete RF components are surface mount and the passive higher frequency components are physically incorporated into the RF circuit card itself as stripline RF circuits.

Thus, by using advanced board materials, a multilayer construction, integral stripline components, and a light weight aluminum housing, it was possible to achieve dramatic weight reductions.

Finally, much effort was expended in "up front engineering" to ensure that this RFD was capable of being transitioned from a laboratory prototype to a production unit capable of being manufactured in large quantities.

en_US
dc.format.mediumBTDen_US
dc.publisherVirginia Techen_US
dc.relation.haspartLD5655.V851_1991.F477.pdfen_US
dc.subjectRadio circuitsen_US
dc.subject.lccLD5655.V851 1991.F477en_US
dc.titleThe design and development of a multilayer RF circuit carden_US
dc.typeMaster’s projecten_US
dc.contributor.departmentSystems Engineeringen_US
dc.description.degreeMaster of Engineeringen_US
thesis.degree.nameMaster of Engineeringen_US
thesis.degree.levelmastersen_US
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen_US
thesis.degree.disciplineSystems Engineeringen_US
dc.contributor.committeechairPratt, Timothy J.en_US
dc.contributor.committeememberRiad, Sedki Mohameden_US
dc.contributor.committeememberDavis, William A.en_US
dc.identifier.sourceurlhttp://scholar.lib.vt.edu/theses/available/etd-02162010-020032/en_US
dc.date.sdate2010-02-16en_US
dc.date.rdate2010-02-16
dc.date.adate2010-02-16en_US


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