This study reports on the development and application of the peninsula blister test to quantitatively measure the adhesion of various adhesively bonded joints. Analytical results reveal that this peninsula-like geometry benefits from both a constant strain energy release rate over the major portion of the debond length and a high strain energy release rate at any given pressure. Applications of this technique to several adhesion systems were conducted. Although some of these systems haven't been successfully tested due to various reasons, experimental results from systems of PSA tapes and thin polyimide films bonded on aluminum substrates were promising. The agreement of the bond strength in terms of strain energy release rates obtained from both experimental and analytical methods from the last two systems indicates the feasibility of this technique. Primary studies on the stress analysis for several thin film adhesion tests suggest that the high ratio of strain energy release rate to applied pressure offered by this modified blister geometry may not be able to overcome the tensile strength limitations of thin film adhesion testing. Further studies need to be conducted in order to understand if the strain energy release rate can be raised without the increase of membrane stresses by altering specimen geometries. In conclusion, although this modified blister is not an universal adhesion test for every adhesion system, the attractive nature of the constant strain energy release rate produced by the peninsula blister specimen warrants further investigations and wider applications.