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dc.contributorVirginia Tech
dc.contributor.authorRowe, R. V. A.
dc.contributor.authorKunita, M. H.
dc.contributor.authorPorto, M. F.
dc.contributor.authorMuniz, E. C.
dc.contributor.authorRubira, A. F.
dc.contributor.authorNery, R. C.
dc.contributor.authorRadovanovic, E.
dc.contributor.authorTaylor, L. T.
dc.contributor.authorNazem, N.
dc.date.accessioned2014-07-21T15:49:39Z
dc.date.available2014-07-21T15:49:39Z
dc.date.issued2001-11
dc.identifier.citationRowe, R. V. A.; Kunita, M. H.; Porto, M. F.; Muniz, E. C.; Rubira, A. F.; Nery, R. C.; Radovanovic, E.; Taylor, L. T.; Nazem, N., "Low-resistance films of polyimides with impregnated copper sulfide," J. Mater. Res., Vol. 16, No. 11, Nov 2001, 3097-3106. DOI: 10.1557/jmr.2001.0427
dc.identifier.issn0884-2914
dc.identifier.urihttp://hdl.handle.net/10919/49638
dc.description.abstractSurface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton (R) polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 degreesC for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton (R) composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.
dc.language.isoen_US
dc.publisherCambridge University Press
dc.subjectsurface modification
dc.subjectmodel compounds
dc.subjectsilver
dc.subjectesca
dc.subjectcus
dc.subjectmaterials science, multidisciplinary
dc.titleLow-resistance films of polyimides with impregnated copper sulfide
dc.typeArticle
dc.identifier.urlhttp://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=7985462&fulltextType=RA&fileId=S0884291400065080
dc.date.accessed2014-07-15
dc.title.serialJournal of Materials Research
dc.identifier.doihttps://doi.org/10.1557/jmr.2001.0427


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