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dc.contributorVirginia Tech. Electrical Engineering Departmenten_US
dc.contributorGeneral Dynamics Fort Worth Divisionen_US
dc.contributor.authorClaus, Richard O.en_US
dc.contributor.authorKline, R. A.en_US
dc.date.accessioned2015-05-04T19:24:42Z
dc.date.available2015-05-04T19:24:42Z
dc.date.issued1979
dc.identifier.citationClaus, R. O., Kline, R. A. (1979). ADHESIVE BONDLINE INTERROGATION USING STONELEY WAVE METHODS. Journal of Applied Physics, 50(12), 8066-8069. doi: 10.1063/1.325943
dc.identifier.issn0021-8979
dc.identifier.urihttp://hdl.handle.net/10919/51983
dc.description.abstractIn this work, a new technique for analyzing interfacial conditions in completed adhesive bonds is discussed. This method is based on the sensitivity of Stoneley waves, which propagate along the boundary between dissimilar solid media, to changes in the material properties of the interface region. Stoneley wave attenuation measured after processing was found to increase as a function of increasing surface roughness in specimens of borosilicate crown glass bonded with an aerobic cement to a substrate of 7740 Pyrex mirrorglass. Possible extensions of these results to high_strength structural adhesively bonded composites are discussed.
dc.format.mimetypeapplication/pdfen_US
dc.language.isoen_US
dc.publisherAmerican Institute of Physics
dc.subjectAdhesionen_US
dc.subjectBorosilicate glassesen_US
dc.subjectMaterials propertiesen_US
dc.subjectMechanical wavesen_US
dc.subjectMirrorsen_US
dc.titleAdhesive bondline interrogation using Stoneley wave methodsen_US
dc.typeArticle - Refereeden_US
dc.contributor.departmentBradley Department of Electrical and Computer Engineeringen_US
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/jap/50/12/10.1063/1.325943
dc.date.accessed2015-04-24
dc.title.serialJournal of Applied Physics
dc.identifier.doihttps://doi.org/10.1063/1.325943
dc.type.dcmitypeTexten_US


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