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dc.date.accessioned2016-08-24T17:55:34Z
dc.date.available2016-08-24T17:55:34Z
dc.date.issued1993-03-16
dc.identifier.urihttp://hdl.handle.net/10919/72795
dc.description.abstractThe imidization temperature of poly(amide-acid) compositions derived from tetracarboxylic acid dianhydrides can be lowered by use of a bis(aminophenoxyphenyl) phosphine oxide in the diamine component which is reacted with the dianhydride. These homo- or copolyimides can be cyclized without use of catalysts or excessive temperature which can product undesired side reactions. Tough film forming materials can be produced which show excellent thermo-oxidative stability and high char yields even at 800.degree. C. in air.
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen_US
dc.publisherUnited States Patent and Trademark Office
dc.titlePoly(amide-acid) compositions derived from tetracarboxylic acid dianhyrides capable of solution imidization
dc.typePatent
dc.identifier.urlhttp://pimg-fpiw.uspto.gov/fdd/65/945/051/0.pdf
dc.date.accessed2016-08-19
dc.type.dcmitypeText
dc.contributor.assigneeVirginia Tech Intellectual Properties, Inc.
dc.contributor.inventorMcGrath, James E.
dc.contributor.inventorGungor, Attila
dc.date.filed1991-07-25
dc.identifier.applicationnumber7735488
dc.subject.uspc524/27
dc.subject.uspcother525/421
dc.subject.uspcother525/422
dc.subject.uspcother528/167
dc.subject.uspcother528/125
dc.subject.uspcother528/126
dc.subject.uspcother528/322
dc.subject.uspcother528/342
dc.subject.uspcother528/350
dc.subject.uspcother528/353
dc.subject.cpcC08G73/1057
dc.subject.cpcC08G79/04
dc.type.patenttypeutility
dc.identifier.patentnumber5194565


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