Hawkins, L. E.2014-03-142014-03-141990-08-05etd-08252008-161949http://hdl.handle.net/10919/39230This investigation addresses the problem of numerically predicting the heat transfer rates between parallel surfaces of the type found in electronic equipment. This has been accomplished through a unique application of the finite-element method for transient or steady-state, two-dimensional mixed convection heat transfer with surface radiation. The approach was specifically geared toward implementation on present engineering workstations. Results are presented for mixed-convection in vertical channels using the full-elliptic form of the Navier-Stokes equations with radiation effects included. The results show that the heat transfer and flow solutions can be significantly affected when not using common approximations and simplifications.xi, 137 leavesBTDapplication/pdfenIn CopyrightLD5655.V856 1990.H385Electronic apparatus and appliancesHeat -- TransmissionDissertationhttp://scholar.lib.vt.edu/theses/available/etd-08252008-161949/