2016-08-242016-08-242002-09-10http://hdl.handle.net/10919/72455An electrostatic self-assembly method of fabricating electrostrictive and piezoelectric thin film assemblies not only provides a thinner film than is attainable by conventional methods, but provides excellent molecular-level uniformity and precise structural control, and thus large, effective piezoelectric coefficients. The method produces a thin film assembly including (a) a substrate, and (b) a film having one or a plurality of layers disposed upon the substrate, wherein at least one of the layers includes a dipolar material, and this layer of dipolar material has a uniform thickness of at most 500 nm.application/pdfen-USPatenthttp://pimg-fpiw.uspto.gov/fdd/87/478/064/0.pdf9559599310/311427/419.3427/419.5427/458427/470427/525428/209428/332428/450428/621428/624428/629428/689428/699428/702B82Y30/00H01L41/37H01L41/183H01L41/193H01L41/317Y10T428/12535Y10T428/12556Y10T428/1259Y10T428/24917Y10T428/266447887