Siddabattula, Kalyan C.2014-03-142014-03-141999-12-03etd-121399-153938http://hdl.handle.net/10919/36110This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond technology, (ii) The Metal Post Interconnected Parallel Plate Structure, and the (iii) Multi Layer Structure. The model developed is validated through experimentation. These models are then used in simulation in order to compare the electrical performance of the packaging technologies. Finally some problems with the existing designs are pointed out, and suggestions (both local and generic) are given to improve the layout design.In CopyrightPackagingModelingThesishttp://scholar.lib.vt.edu/theses/available/etd-121399-153938/