Kim, Woochan2015-01-072015-01-072015-01-06vt_gsexam:3944http://hdl.handle.net/10919/51170Double-sided module exhibits electrical and thermal characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided module to reduce the stress to a level acceptable by silicon dice. For a 14 mm x 21 mm module carrying 6.6 mm x 6.6 mm die, finite-element simulation suggested an optimal design having four posts located 1 mm from the die; the z-direction stress at the chip was reduced from 17 MPa to 0.6 MPa.ETDIn CopyrightDouble-sided diewafer-bonded chiphourglass jointcompressive postmodule fabricationmodule characterizationhigh density integrationthermal managementthermo-mechanical stressreliability testDissertation