Lai, Yeh-Hung2014-03-142014-03-141988-12-05etd-08012012-040318http://hdl.handle.net/10919/44077This study developed and analyzed a modification of the blister test permitting nearly constant strain energy release rate testing of adhesive bonds. The work consisted of three parts; (1) development of the testing technique to evaluate strain energy release rate and to record the time dependent nature of the fracture process, (2) numerical analysis of the constrained blister test to determine the applicability of an approximate solution for several materials, and (3) development of an. analytical technique to evaluate the strain energy release rate for relatively stiff specimens.vi, 90 leavesBTDapplication/pdfenIn CopyrightLD5655.V855 1988.L345Adhesives -- TestingFracture mechanicsThesishttp://scholar.lib.vt.edu/theses/available/etd-08012012-040318/