Virginia TechHarikrishna, H.Ducker, William A.Huxtable, Scott T.2014-01-212014-01-212013-06-01Harikrishna, Hari; Ducker, William A.; Huxtable, Scott T., "The influence of interface bonding on thermal transport through solid-liquid interfaces," Appl. Phys. Lett. 102, 251606 (2013); http://dx.doi.org/10.1063/1.48127490003-6951http://hdl.handle.net/10919/24922We use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, W-SL, for a series of five alkane-thiol monolayers at the gold-water interface. W-SL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in W-SL, are achieved by varying the terminal group (omega-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60-190 MW m(-2) K-1, and the solid-liquid contact angles span from 25 degrees to 118 degrees. (C) 2013 AIP Publishing LLC.en-USIn CopyrightHeatGoldPhysicsArticle - Refereedhttp://scitation.aip.org/content/aip/journal/apl/102/25/10.1063/1.4812749https://doi.org/10.1063/1.4812749