2021-03-252021-03-252019-05-14http://hdl.handle.net/10919/102834A power device package includes a dielectric substrate having an upper conductor layer and a lower conductor layer, a semiconductor die coupled to the upper conductor layer of the dielectric substrate via conductive adhesive, a cooler including a protruding hillock having a top surface and outer sides, the lower conductor layer of the dielectric substrate being coupled to the surface of the protruding hillock via an adhesive, and a magnetic material attached mateably around the protruding hillock. The magnetic material includes inner sides abutting the outer sides of the protruding hillock.application/pdfPatenthttp://pimg-fpiw.uspto.gov/fdd/87/905/102/0.pdf15622802H01L23/552H01L23/367H01L23/642H01L23/645H01L25/0655H01L25/072H01L25/18H01F1/344H01L29/1608H01L2224/48472H01L2224/49111H01L2924/19107H03K5/0810290587