Hume Center for National Security and Technology

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Browsing Hume Center for National Security and Technology by Author "Aerospace and Ocean Engineering"

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    A Coupled OpenFOAM-WRF Study on Atmosphere-Wake-Ocean Interaction
    Gilbert, John; Pitt, Jonathan (MDPI, 2020-12-30)
    This work aims to better understand how small scale disturbances that are generated at the air-sea interface propagate into the surrounding atmosphere under realistic environmental conditions. To that end, a one-way coupled atmosphere-ocean model is presented, in which predictions of sea surface currents and sea surface temperatures from a microscale ocean model are used as constant boundary conditions in a larger atmospheric model. The coupled model consists of an ocean component implemented while using the open source CFD software OpenFOAM, an atmospheric component solved using the Weather Research and Forecast (WRF) model, and a Python-based utility foamToWRF, which is responsible for mapping field data between the ocean and atmospheric domains. The results are presented for two demonstration cases, which indicate that the proposed coupled model is able to capture the propagation of small scale sea surface disturbances in the atmosphere, although a more thorough study is required in order to properly validate the model.
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    Multi-Physics Modeling of Electrochemical Deposition
    Kauffman, Justin; Gilbert, John; Paterson, Eric G. (MDPI, 2020-12-11)
    Electrochemical deposition (ECD) is a common method used in the field of microelectronics to grow metallic coatings on an electrode. The deposition process occurs in an electrolyte bath where dissolved ions of the depositing material are suspended in an acid while an electric current is applied to the electrodes. The proposed computational model uses the finite volume method and the finite area method to predict copper growth on the plating surface without the use of a level set method or deforming mesh because the amount of copper layer growth is not expected to impact the fluid motion. The finite area method enables the solver to track the growth of the copper layer and uses the current density as a forcing function for an electric potential field on the plating surface. The current density at the electrolyte-plating surface interface is converged within each PISO (Pressure Implicit with Splitting Operator) loop iteration and incorporates the variance of the electrical resistance that occurs via the growth of the copper layer. This paper demonstrates the application of the finite area method for an ECD problem and additionally incorporates coupling between fluid mechanics, ionic diffusion, and electrochemistry.