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Browsing by Author "Qi, Jia"

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    Measurement of Surface and Interfacial Energies between Solid Materials Using an Elastica Loop
    Qi, Jia (Virginia Tech, 2000-09-11)
    The measurement of the work of adhesion is of significant technical interest in a variety of applications, ranging from a basic understanding of material behavior to the practical aspects associated with making strong, durable adhesive bonds. The objective of this thesis is to investigate a novel technique using an elastica loop to measure the work of adhesion between solid materials. Considering the range and resolution of the measured parameters, a specially designed apparatus with a precise displacement control system, an analytical balance, an optical system, and a computer control and data acquisition interface is constructed. An elastica loop made of poly(dimethylsiloxane) [PDMS] is attached directly to a stepper motor in the apparatus. To perform the measurement, the loop is brought into contact with various substrates as controlled by the computer interface, and information including the contact patterns, contact lengths, and contact forces is obtained. Experimental results indicate that due to anticlastic bending, the contact first occurs at the edges of the loop, and then spreads across the width as the displacement continues to increase. The patterns observed show that the loop is eventually flattened in the contact region and the effect of anticlastic bending of the loop is reduced. Compared to the contact diameters observed in the classical JKR tests, the contact length obtained using this elastica loop technique is, in general, larger, which provides potential for applications of this technique in measuring interfacial energies between solid materials with high moduli. The contact procedure is also simulated to investigate the anticlastic bending effect using finite element analysis with ABAQUS. The numerical simulation is conducted using a special geometrically nonlinear, elastic, contact mechanics algorithm with appropriate displacement increments. Comparisons of the numerical simulation results, experimental data, and the analytical solution are made.