Poly(amide-acid) compositions derived from tetracarboxylic acid dianhyrides capable of solution imidization
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Date
1993-03-16
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United States Patent and Trademark Office
Abstract
The imidization temperature of poly(amide-acid) compositions derived from tetracarboxylic acid dianhydrides can be lowered by use of a bis(aminophenoxyphenyl) phosphine oxide in the diamine component which is reacted with the dianhydride. These homo- or copolyimides can be cyclized without use of catalysts or excessive temperature which can product undesired side reactions. Tough film forming materials can be produced which show excellent thermo-oxidative stability and high char yields even at 800.degree. C. in air.