Thermal transport across nanoscale solid-fluid interfaces

dc.contributorVirginia Techen
dc.contributor.authorMurad, Sohailen
dc.contributor.authorPuri, Ishwar K.en
dc.contributor.departmentBiomedical Engineering and Mechanicsen
dc.date.accessed2014-03-27en
dc.date.accessioned2014-04-16T14:16:48Zen
dc.date.available2014-04-16T14:16:48Zen
dc.date.issued2008-03-01en
dc.description.abstractAn explanation for the effective thermal resistance R(K) can be based on the impedance to the passage of thermal phonons across an interface. We conjecture that (1) increasing the fluid pressure, and (2) making an interface more hydrophilic should facilitate better acoustic matching and thus lower R(K). Our molecular dynamics simulations confirm this. Overall, R(K) decreases with increasing temperature and is inversely proportional to the heat flux.en
dc.description.sponsorshipNSF Grant CBET-0730026en
dc.format.mimetypeapplication/pdfen
dc.identifier.citationMurad, Sohail; Puri, Ishwar K., "Thermal transport across nanoscale solid-fluid interfaces," Appl. Phys. Lett. 92, 133105 (2008); http://dx.doi.org/10.1063/1.2905281en
dc.identifier.doihttps://doi.org/10.1063/1.2905281en
dc.identifier.issn0003-6951en
dc.identifier.urihttp://hdl.handle.net/10919/47417en
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/apl/92/13/10.1063/1.2905281en
dc.language.isoen_USen
dc.publisherAIP Publishingen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectMolecular dynamicsen
dc.subjectHeat transferen
dc.subjectWateren
dc.subjectResistanceen
dc.subjectSimulationen
dc.subjectMembranesen
dc.subjectHeliumen
dc.titleThermal transport across nanoscale solid-fluid interfacesen
dc.title.serialApplied Physics Lettersen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten

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