A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line

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dc.contributorVirginia Techen
dc.contributor.authorXiao, Keweien
dc.contributor.authorNgo, Khai D. T.en
dc.contributor.authorLu, Guo-Quanen
dc.contributor.departmentElectrical and Computer Engineeringen
dc.contributor.departmentCenter for Power Electronics Systemsen
dc.contributor.departmentMaterials Science and Engineeringen
dc.date.accessed2014-07-15en
dc.date.accessioned2014-07-21T15:49:39Zen
dc.date.available2014-07-21T15:49:39Zen
dc.date.issued2014-04-01en
dc.description.abstractThe low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronic devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micrometer- or nanometer-sized particles) mixed in organic solvent and binder formulation. It is believed that the drying of the paste during the bonding process plays a critical role in determining the quality of the sintered bond-line. In this study, a model based on the diffusion of solvent molecules and viscous mechanics of the paste was introduced to determine the stress and strain states of the silver bond-line. A numerical simulation algorithm of the model was developed and coded in the C++ programming language. The numerical simulation allows determination of the time-dependent physical properties of the silver bond-line as the paste is being dried with a heating profile. The properties studied were solvent concentration, weight loss, shrinkage, stress, and strain. The stress is the cause of cracks in the bond-line and bond-line delamination. The simulated results were verified by experiments in which the formation of bond-line cracks and interface delamination was observed during the pressure-free drying of a die-attach nanosilver paste. The simulated results were consistent with our earlier experimental findings that the use of uniaxial pressure of a few mega-Pascals during the drying stage of a nanosilver paste was sufficient to produce high-quality sintered joints. The insight offered by this modeling study can be used to develop new paste formulations that enable pressure-free, low-temperature sintering of the die-attach material to significantly lower the cost of implementing the LTJT in manufacturing.en
dc.description.sponsorshipNational Science Foundation under Award Number CBET-1048621en
dc.format.mimetypeapplication/pdfen
dc.identifier.citationXiao, K.; Ngo, K. D. T.; Lu, G. Q., "A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line," J. Mater. Res., Vol. 29, No. 8, 2014, 1006-1017. DOI: 10.1557/jmr.2014.42en
dc.identifier.doihttps://doi.org/10.1557/jmr.2014.42en
dc.identifier.issn0884-2914en
dc.identifier.urihttp://hdl.handle.net/10919/49639en
dc.identifier.urlhttp://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=9252135&fulltextType=RA&fileId=S0884291414000429en
dc.language.isoenen
dc.publisherCambridge University Pressen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectBondingen
dc.subjectKineticsen
dc.subjectSinteringen
dc.subjectShrinkageen
dc.subjectModelsen
dc.subjectPasteen
dc.subjectMaterials science, multidisciplinaryen
dc.titleA diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-lineen
dc.title.serialJournal of Materials Researchen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten

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Scholarly Works, Center for Power Electronics Systems
Scholarly Works, Electrical and Computer Engineering
Scholarly Works, Materials Science and Engineering (MSE)