Electrostrictive and piezoelectric thin film assemblies and method of fabrication therefor

dc.contributor.assigneeVirginia Tech Intellectual Properties, Inc.en
dc.contributor.inventorClaus, Richard O.en
dc.contributor.inventorLiu, Yanjingen
dc.contributor.inventorZeng, Tingyingen
dc.date.accessed2016-08-19en
dc.date.accessioned2016-08-24T17:54:19Zen
dc.date.available2016-08-24T17:54:19Zen
dc.date.filed2000-04-28en
dc.date.issued2002-09-10en
dc.description.abstractAn electrostatic self-assembly method of fabricating electrostrictive and piezoelectric thin film assemblies not only provides a thinner film than is attainable by conventional methods, but provides excellent molecular-level uniformity and precise structural control, and thus large, effective piezoelectric coefficients. The method produces a thin film assembly including (a) a substrate, and (b) a film having one or a plurality of layers disposed upon the substrate, wherein at least one of the layers includes a dipolar material, and this layer of dipolar material has a uniform thickness of at most 500 nm.en
dc.format.mimetypeapplication/pdfen
dc.identifier.applicationnumber9559599en
dc.identifier.patentnumber6447887en
dc.identifier.urihttp://hdl.handle.net/10919/72455en
dc.identifier.urlhttp://pimg-fpiw.uspto.gov/fdd/87/478/064/0.pdfen
dc.language.isoen_USen
dc.publisherUnited States Patent and Trademark Officeen
dc.subject.cpcB82Y30/00en
dc.subject.cpcH01L41/37en
dc.subject.cpcH01L41/183en
dc.subject.cpcH01L41/193en
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dc.subject.uspc310/311en
dc.subject.uspcother427/419.3en
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dc.subject.uspcother428/689en
dc.subject.uspcother428/699en
dc.subject.uspcother428/702en
dc.titleElectrostrictive and piezoelectric thin film assemblies and method of fabrication thereforen
dc.typePatenten
dc.type.dcmitypeTexten
dc.type.patenttypeutilityen

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