Method and apparatus for three-dimensional integration of embedded power module

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dc.contributor.assigneeVirginia Tech Intellectual Properties, Inc.en
dc.contributor.inventorLim, Michele H.en
dc.contributor.inventorLiang, Zhenxianen
dc.contributor.inventorvan Wyk, J. D.en
dc.date.accessed2016-08-19en
dc.date.accessioned2016-08-24T17:55:04Zen
dc.date.available2016-08-24T17:55:04Zen
dc.date.filed2007-04-17en
dc.date.issued2011-04-26en
dc.description.abstractA modified planar Low Temperature Co-Fired Ceramic (LTCC) high conductance inductor, embedding a large cross section conductor, supports a stacked arrangement of heat spreader, inductor and active device layers. Interlayer electrical connections connect the layers. Optionally, a DC-DC converter includes the modified planar LTCC high conductance inductor, embedding a large cross section conductor, supporting a stacked arrangement of heat spreader, capacitor and active device layers, the active devices layer including the switching transistors. The active devices layer may include semiconductor dies embedded in a substrate.en
dc.format.mimetypeapplication/pdfen
dc.identifier.applicationnumber11736217en
dc.identifier.patentnumber7932800en
dc.identifier.urihttp://hdl.handle.net/10919/72664en
dc.identifier.urlhttp://pimg-fpiw.uspto.gov/fdd/00/328/079/0.pdfen
dc.language.isoen_USen
dc.publisherUnited States Patent and Trademark Officeen
dc.subject.cpcH01F17/0033en
dc.subject.cpcH01F41/043en
dc.subject.cpcH01F38/42en
dc.subject.cpcH01F2017/002en
dc.subject.cpcH02M3/155en
dc.subject.cpcY10T29/4902en
dc.subject.uspc29/602.1en
dc.subject.uspcother336/200en
dc.subject.uspcother336/55en
dc.subject.uspcother336/61en
dc.subject.uspcother336/141en
dc.subject.uspcother336/232en
dc.subject.uspcother361/270en
dc.subject.uspcother363/16en
dc.titleMethod and apparatus for three-dimensional integration of embedded power moduleen
dc.typePatenten
dc.type.dcmitypeTexten
dc.type.patenttypeutilityen

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