An x‐ray study of diffusion in the Cu‐Ag system

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dc.contributorVirginia Tech. Department of Materials Engineeringen
dc.contributor.authorUnnam, Jalaiahen
dc.contributor.authorHouska, Charles R.en
dc.contributor.departmentMaterials Science and Engineering (MSE)en
dc.date.accessed2015-04-24en
dc.date.accessioned2015-05-21T19:47:33Zen
dc.date.available2015-05-21T19:47:33Zen
dc.date.issued1976en
dc.description.abstractThe interdiffusion coefficients for both solid phases of the Ag‐Cu system have been determined from x‐ray diffraction and electron microprobe data. Specimens containing 3.2 μm of Ag on a (111) ‐oriented Cu crystal were used for the x‐ray studies, while a 15‐μm deposit of Ag was used for the probe specimens. Composition profiles for each phase were obtained from the x‐ray intensity bands and a new iterative one‐dimensional model was applied to determine the composition‐dependent diffusion coefficients. The average diffusion coefficients for both phases are nearly equal at about 10−10 cm2/sec at 750 °C, the diffusion temperature. Also, the solubility for the Ag‐rich phase is about three times the solubility for the Cu‐rich phase. These conditions result in interface reversal, i.e., the interface first moves into the substrate and later moves toward the free surface.Structural damage resulting from atomic diffusion was found to be much smaller for the Ag‐Cu system than for other single‐phase Cu‐base specimens that have been examined. Both crystal misorientation (tilt) and subgrains are formed as a result of diffusion. The subgrain shape in the plating depends upon the ratio of the thickness to the initial grain size of the plating.en
dc.description.sponsorshipNational Science Foundation (U.S.)en
dc.format.extent8 pagesen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationUnnam, J., Houska, C. R. (1976). An x‐ray study of diffusion in the Cu‐Ag system. Journal of Applied Physics, 47(10), 4336-4342. doi: 10.1063/1.322435en
dc.identifier.doihttps://doi.org/10.1063/1.322435en
dc.identifier.issn0021-8979en
dc.identifier.urihttp://hdl.handle.net/10919/52494en
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/jap/47/10/10.1063/1.322435en
dc.language.isoen_USen
dc.publisherAmerican Institute of Physicsen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectDiffusionen
dc.subjectSolubilityen
dc.subjectBand modelsen
dc.subjectChemical interdiffusionen
dc.subjectCopperen
dc.titleAn x‐ray study of diffusion in the Cu‐Ag systemen
dc.title.serialJournal of Applied Physicsen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten

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