Semiconductor module arrangement
dc.contributor.assignee | Virginia Tech Intellectual Properties, Inc. | en |
dc.contributor.department | Electrical and Computer Engineering | en |
dc.contributor.department | Center for Power Electronics Systems | en |
dc.contributor.inventor | DiMarino, Christina | en |
dc.contributor.inventor | Boroyevich, Dushan | en |
dc.contributor.inventor | Burgos, Rolando | en |
dc.contributor.inventor | Johnson, Mark | en |
dc.date.accessed | 2019-02-15 | en |
dc.date.accessioned | 2019-02-26T22:24:03Z | en |
dc.date.available | 2019-02-26T22:24:03Z | en |
dc.date.filed | 2017-05-03 | en |
dc.date.issued | 2018-07-24 | en |
dc.description.abstract | In a switching module structure that includes a low-impedance path to ground, such as a parasitic capacitance of an insulating substrate, a further insulating substrate presenting a parasitic capacitance placed in series with the low impedance current path and a connection of a conductive layer to input voltage rails using a single decoupling capacitor or, preferably, a midpoint of the voltage rails formed by a series connection of decoupling capacitors maintains a large portion of common mode (CM) currents which are due to high dV/dt slew rates of SiC and GaN transistors within the switching module. | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.applicationnumber | 15585545 | en |
dc.identifier.patentnumber | 10032732 | en |
dc.identifier.uri | http://hdl.handle.net/10919/87843 | en |
dc.identifier.url | http://pimg-fpiw.uspto.gov/fdd/32/327/100/0.pdf | en |
dc.language.iso | en | en |
dc.publisher | United States Patent and Trademark Office | en |
dc.subject.cpc | H01L23/66 | en |
dc.subject.cpc | H01L23/481 | en |
dc.subject.cpc | H01L25/0652 | en |
dc.subject.cpc | H01L25/0657 | en |
dc.subject.cpc | H01L2224/1134 | en |
dc.subject.cpc | H05K1/167 | en |
dc.subject.cpc | H05K3/4614 | en |
dc.title | Semiconductor module arrangement | en |
dc.type | Patent | en |
dc.type.dcmitype | Text | en |
dc.type.patenttype | utility | en |
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