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Multiple exposure with image reversal in a single photoresist layer

dc.contributor.assigneeVirginia Tech Intellectual Properties, Inc.en
dc.contributor.inventorOrlowski, Marius K.en
dc.contributor.inventorNdoye, Coumbaen
dc.date.accessed2016-08-19en
dc.date.accessioned2016-08-24T17:55:26Zen
dc.date.available2016-08-24T17:55:26Zen
dc.date.filed2011-08-09en
dc.date.issued2015-08-25en
dc.description.abstractMultiple patterned exposures of a single layer of image reversal resist prior to and following image reversal processing, upon development, respond to the respective exposures as either a positive or a negative resist, allowing a desired shape of a resist structure to be built up from any of a number of combinations of primitive masks. Exploiting the image reversal resist in this manner allows several types of diffraction distortion to be entirely avoided and for many sophisticated lithographic processes to he reduced in complexity by one-half or more while any desired resist structure shape can be formed form a limited number of primitive mask patterns. A regimen, which may be automated as an executable algorithm for a computer may be followed to evaluate different combinations of masks which are valid to produce a desired resist structure shape and select the optimum mask pattern combination to do so.en
dc.format.mimetypeapplication/pdfen
dc.identifier.applicationnumber13814356en
dc.identifier.patentnumber9116432en
dc.identifier.urihttp://hdl.handle.net/10919/72759en
dc.identifier.urlhttp://pimg-fpiw.uspto.gov/fdd/32/164/091/0.pdfen
dc.language.isoen_USen
dc.publisherUnited States Patent and Trademark Officeen
dc.subject.cpcG03F7/2022en
dc.subject.cpcG03F7/2024en
dc.subject.cpcG03F7/203en
dc.subject.cpcG03F7/095en
dc.subject.cpcG03F7/26en
dc.subject.cpcH01L21/0272en
dc.subject.cpcH01L21/0274en
dc.subject.cpcY10T428/24802en
dc.subject.uspc1/1en
dc.titleMultiple exposure with image reversal in a single photoresist layeren
dc.typePatenten
dc.type.dcmitypeTexten
dc.type.patenttypeutilityen

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