Adhesive bondline interrogation using Stoneley wave methods

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dc.contributorVirginia Tech. Electrical Engineering Departmenten
dc.contributorGeneral Dynamics Fort Worth Divisionen
dc.contributor.authorClaus, Richard O.en
dc.contributor.authorKline, R. A.en
dc.contributor.departmentElectrical and Computer Engineeringen
dc.date.accessed2015-04-24en
dc.date.accessioned2015-05-04T19:24:42Zen
dc.date.available2015-05-04T19:24:42Zen
dc.date.issued1979en
dc.description.abstractIn this work, a new technique for analyzing interfacial conditions in completed adhesive bonds is discussed. This method is based on the sensitivity of Stoneley waves, which propagate along the boundary between dissimilar solid media, to changes in the material properties of the interface region. Stoneley wave attenuation measured after processing was found to increase as a function of increasing surface roughness in specimens of borosilicate crown glass bonded with an aerobic cement to a substrate of 7740 Pyrex mirrorglass. Possible extensions of these results to high_strength structural adhesively bonded composites are discussed.en
dc.format.mimetypeapplication/pdfen
dc.identifier.citationClaus, R. O., Kline, R. A. (1979). ADHESIVE BONDLINE INTERROGATION USING STONELEY WAVE METHODS. Journal of Applied Physics, 50(12), 8066-8069. doi: 10.1063/1.325943en
dc.identifier.doihttps://doi.org/10.1063/1.325943en
dc.identifier.issn0021-8979en
dc.identifier.urihttp://hdl.handle.net/10919/51983en
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/jap/50/12/10.1063/1.325943en
dc.language.isoenen
dc.publisherAmerican Institute of Physicsen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectAdhesionen
dc.subjectBorosilicate glassesen
dc.subjectMaterials propertiesen
dc.subjectMechanical wavesen
dc.subjectMirrorsen
dc.titleAdhesive bondline interrogation using Stoneley wave methodsen
dc.title.serialJournal of Applied Physicsen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten

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