Cooler with emi-limiting inductor

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dc.contributor.assigneeVirginia Tech Intellectual Properties, Inc.en
dc.contributor.assigneeToyota Motor Engineering & Manufacturing North America, Inc.en
dc.contributor.inventorNgo, Khaien
dc.contributor.inventorWang, Chi-Mingen
dc.contributor.inventorCui, Hanen
dc.date.accessed2021-03-23en
dc.date.accessioned2021-03-25T18:15:44Zen
dc.date.available2021-03-25T18:15:44Zen
dc.date.filed2017-06-14en
dc.date.issued2019-05-14en
dc.description.abstractA power device package includes a dielectric substrate having an upper conductor layer and a lower conductor layer, a semiconductor die coupled to the upper conductor layer of the dielectric substrate via conductive adhesive, a cooler including a protruding hillock having a top surface and outer sides, the lower conductor layer of the dielectric substrate being coupled to the surface of the protruding hillock via an adhesive, and a magnetic material attached mateably around the protruding hillock. The magnetic material includes inner sides abutting the outer sides of the protruding hillock.en
dc.format.mimetypeapplication/pdfen
dc.identifier.applicationnumber15622802en
dc.identifier.patentnumber10290587en
dc.identifier.urihttp://hdl.handle.net/10919/102834en
dc.identifier.urlhttp://pimg-fpiw.uspto.gov/fdd/87/905/102/0.pdfen
dc.languageenen
dc.publisherUnited States Patent and Trademark Officeen
dc.subject.cpcH01L23/552en
dc.subject.cpcH01L23/367en
dc.subject.cpcH01L23/642en
dc.subject.cpcH01L23/645en
dc.subject.cpcH01L25/0655en
dc.subject.cpcH01L25/072en
dc.subject.cpcH01L25/18en
dc.subject.cpcH01F1/344en
dc.subject.cpcH01L29/1608en
dc.subject.cpcH01L2224/48472en
dc.subject.cpcH01L2224/49111en
dc.subject.cpcH01L2924/19107en
dc.subject.cpcH03K5/08en
dc.titleCooler with emi-limiting inductoren
dc.typePatenten
dc.type.dcmitypeTexten
dc.type.patenttypeutilityen

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