Statistics for Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules
Total visits
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| Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules | 224 |
Total visits per month
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| January 2024 | 5 |
| February 2024 | 3 |
| March 2024 | 4 |
| April 2024 | 4 |
| May 2024 | 7 |
| June 2024 | 5 |
| July 2024 | 1 |
File Visits
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| Lester_DK_T_2023.pdf | 273 |
Top country views
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| United States | 71 |
| China | 12 |
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| Hong Kong SAR China | 8 |
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| Ukraine | 1 |
Top city views
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| Vienna | 13 |
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| Botevgrad | 3 |
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| Castro Valley | 2 |
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| Amman | 1 |
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| Chang-hua | 1 |
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| Fremont | 1 |
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| Tianjin | 1 |
| Washington | 1 |
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