Statistics for Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules
Total visits
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| Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules | 259 |
Total visits per month
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| September 2024 | 10 |
| October 2024 | 6 |
| November 2024 | 1 |
| December 2024 | 7 |
| January 2025 | 2 |
| February 2025 | 3 |
| March 2025 | 1 |
File Visits
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| Lester_DK_T_2023.pdf | 348 |
Top country views
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| United States | 71 |
| China | 12 |
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| Hong Kong SAR China | 8 |
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Top city views
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| Vienna | 13 |
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| Chang-hua | 1 |
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