Browsing by Author "Chang, Kuo-lih"
Now showing 1 - 1 of 1
Results Per Page
Sort Options
- Interface structure and adhesion of wafer-bonded GaN/GaN and GaN/AlGaN semiconductorsShi, Frank F.; Chang, Kuo-lih; Hsieh, Kuang-Chien; Guido, Louis J.; Hoke, Bill (American Institute of Physics, 2004-02-01)Material integrations of GaN/GaN and Al0.25Ga0.75N/GaN semiconductors through wafer bonding technology were reported in this work. The wafer surface and interface microstructures were characterized by scanning electron microscopy and energy dispersive x-ray spectroscopy. The interface adhesion (bonding strength) was estimated based upon the interface fracture energy gamma(o) measured by double-cantilever beam technique. The interface adhesion properties of several different wafer-bonded III-V semiconductors were also compared. By comparing the atomic chemical bond energy E-o with the measured interface fracture energy gamma(o), the bondability of a few major III-V semiconductors was analyzed. (C) 2004 American Institute of Physics.