Browsing by Author "Love, B. J."
Now showing 1 - 2 of 2
Results Per Page
Sort Options
- Design Of A Z-Axis Translating Laser Light Scattering Device For Particulate Settling Measurement in Dispersed FluidsHoffman, D. L.; Brooks, D. R.; Dolez, P. I.; Love, B. J. (AIP Publishing, 2002-06-01)A user friendly, Labview(TM) controlled, prototype settling device has been designed and built that incorporates a laser light source and detector fixtured to a z-axis translating stage. The Labview(TM) data interface drives the unit and captures data in the form of scattered intensity as a function of z-axis location. We present some examples of sample output from low- and high-density particles settling in epoxy fluids of various viscosities. This device maps all of the expected settling regimes and, more importantly, valuable scattering information about partial settling is found in instances without a discrete mud line. The effect of resin viscosity on settling has been measured and corresponds well to model predictions. Measurement of settling data in the compression regime was also achievable, validating descriptive models. (C) 2002 American Institute of Physics.
- Transience of plasma surface modification as an adhesion promoter for polychlorotrifluorethyleneSubrahmanyan, Sumitra; Dillard, John G.; Love, B. J.; Romand, M.; Charbonnier, M. (American Institute of Physics, 2002-05-01)Poly (chlorotrifluoroethylene) (PCTFE) and other fluoropolymers are increasingly used as inner layer dielectrics. However, these polymers have low surface energies and correspondingly poor adhesive proper-ties. Results are presented on the use of a low-pressure ammonia plasma to enhance the surface bondability of PCTFE. The plasma modified PCTFE film surfaces were characterized by x-ray photoelectron spectroscopy and contact angle measurements, Surface modified films exhibited improved adhesion to electroless copper deposits (180degrees peel test) compared to coated PCTFE controls and that underwent no plasma exposure. Annealing studies were conducted between 30 and 100 degreesC to examine the stability of the plasma-modified surfaces. For samples annealed below T-g. contact angle measurements indicated that the plasma-introduced groups remained bound on the surface for four weeks. For specimens annealed above Tg, the surface functionalities were absorbed within the bulk and surface rearrangement occurred within 10 h of annealing time. As a result of rearrangement, the benefit of adhesion enhancement by plasma is lost and the adhesion to copper is reduced. (C) 2002 American Vacuum Society.