Thermal analysis of power hybrid microelectronic packages
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In addition to the above, a series of experiments were conducted on various hybrid circuits samples for a low and high heat sink external resistance, i.e., large and small convective heat transfer coefficients, respectively. These samples were constructed using thick film resistors as heat sources on alumina and beryllia substrates. The temperature rise was measured using infrared thermal imaging technique. These experimental results were compared to results predicted by the thermal model. In general, the model underpredicts or overpredicts the experimental temperature rise by 0-2 Â·C and the agreement is within the experimental uncertainty of Â±2Â°C.
- Doctoral Dissertations