dc.contributor.author	Zhang, Michael Tao	en
dc.contributor.committeecochair	Jovanovic, Milan M.	en
dc.contributor.committeecochair	Lee, Fred C.	en
dc.contributor.committeemember	Nelson, Douglas J.	en
dc.contributor.committeemember	Chen, Dan Y.	en
dc.contributor.committeemember	Chang, Lay Nam	en
dc.contributor.committeemember	Boroyevich, Dushan	en
dc.contributor.department	Electrical and Computer Engineering	en
dc.date.accessioned	2014-03-14T20:21:23Z	en
dc.date.adate	1998-02-17	en
dc.date.available	2014-03-14T20:21:23Z	en
dc.date.issued	1998-02-17	en
dc.date.rdate	1998-02-17	en
dc.date.sdate	1998-07-11	en
dc.description.abstract	This work presents the analyses and designs of high-density, low-profile power supplies, including the electrical, thermal, and EMI aspects. Emphasis is placed on forward and flyback converters. The efficiency improvements of employing synchronous rectification are theoretically derived and experimentally verified in forward and flyback converters. The performances of synchronous rectifiers in forward converters are analyzed with regards to transformer reset and SR driven method. The effectiveness of synchronous rectification in flyback converters is evaluated in various operation modes and control schemes. The paralleling techniques utilized to realize high-density, low-profile power conversion are presented. Current sharing in transformer paralleling is addressed and evaluated in forward topology. The performance and the operation principles of one-choke and two-choke interleaved forward converters are analyzed. The thermal management of high-density power supplies in sealed enclosures is optimized using computational fluid dynamics simulations. The theoretical limit of power density due to thermal constraint is determined. In addition, the thermal-design optimization guidelines are given and verified experimentally. A systematic methodology is developed to facilitate the analysis and design of conducted EMI problems in high-density power supplies. Partial element equivalent circuit method is employed for parasitic parameter extraction. Layout and packaging are optimized to minimize conducted EMI noises. Noise predictions by Saber simulations are confirmed by experimental measurements.	en
dc.description.degree	Ph. D.	en
dc.identifier.other	etd-173510281975580	en
dc.identifier.sourceurl	http://scholar.lib.vt.edu/theses/available/etd-173510281975580/	en
dc.identifier.uri	http://hdl.handle.net/10919/30316	en
dc.publisher	Virginia Tech	en
dc.relation.haspart	append.pdf	en
dc.relation.haspart	chapter1.pdf	en
dc.relation.haspart	chapter2.pdf	en
dc.relation.haspart	chapter3.pdf	en
dc.relation.haspart	chapter4.pdf	en
dc.relation.haspart	chapter5.pdf	en
dc.relation.haspart	chapter6.pdf	en
dc.relation.haspart	etd.pdf	en
dc.relation.haspart	referenc.pdf	en
dc.relation.haspart	vita.pdf	en
dc.rights	In Copyright	en
dc.rights.uri	http://rightsstatements.org/vocab/InC/1.0/	en
dc.subject	none	en
dc.title	Electrical, Thermal, and EMI Designs of High-Density, Low-Profile Power Supplies	en
dc.type	Dissertation	en
thesis.degree.discipline	Electrical and Computer Engineering	en
thesis.degree.grantor	Virginia Polytechnic Institute and State University	en
thesis.degree.level	doctoral	en
thesis.degree.name	Ph. D.	en

Electrical, Thermal, and EMI Designs of High-Density, Low-Profile Power Supplies

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