Towards Cyber-Physical Security for Additively Manufactured Parts via In Situ Monitoring and Electromechanical Impedance

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Date

2025-01-22

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Journal ISSN

Volume Title

Publisher

Virginia Tech

Abstract

The layer-by-layer nature of additive manufacturing (AM) allows for toolless fabrication of highly complex geometries that cannot be made via traditional processes. AM is unique in its ability to precisely define both the material properties and geometric shape throughout the volume of a part, giving designers unmatched freedom in the creation of new components. However, this freedom of design also creates numerous challenges in the qualification of these parts. As AM processes primitive material in real time to produce each voxel of part volume, manufacturing defects may be dispersed anywhere throughout the part. Many part designs may have complex geometries or material parameters that are challenging for traditional qualification and inspection techniques to inspect for such embedded errors. Even more troubling, this freedom of design also extends to malicious actors, who would then be able to embed intentional targeted defects within the volume of the part. As the AM process is driven almost entirely by computer controlled machines and cyber-domain data, the AM process is uniquely at risk of nearly undetectable cyber-physical attacks, or cyber attacks that can cause physical damage. Additionally, as much of the valuable intellectual property associated with the design and material parameters of parts are stored in digital form, theft of these design files could result in mass replication of lower quality counterfeit parts, putting the supply chain of these AM parts at risk. In order to mitigate these vulnerabilities in the AM process, prior works have focused on in situ monitoring of the manufacturing process in order to ensure the part is constructed as expected. Typically for in situ monitoring, the constructed geometry is compared to the design files associated with the part in question using a monitoring system connected to either the AM machine or the larger network. However, such methods trust the validity of both the design files and monitoring systems used for verification, when either or both may have also been attacked. Therefore, a valid in situ monitoring method needs secure access to a provable set of validation data, while also isolating or air-gapping itself from the network to prevent cyber attacks on the monitoring system itself. Similarly, other works have focused on mitigating the risk of counterfeiting by novel means of part identification tailored for the AM process. Many of these identification methods leverage stochastic or prescribed features, such as surface patterns measured via visible or ultraviolet scanning, or internal porosity features measured via x-ray computed tomography (CT) scanning. However, these surface features are not impacted by alterations or damage to the part in areas away from the specific features being measured, possibly preventing the detection of attacks or damage to other areas of the part in transit. CT scanning can be used to detect damage or alterations to more areas of the part and incorporate this measurement into the identification mechanism, but may be prohibitively expensive while also possibly failing to properly penetrate and measure a sufficiently complex AM part. In this work, efforts to expand the cyber-physical security of the AM process are explored, including (1) a novel method of in situ process validation by means of covertly transmit- ting process quality information to an otherwise air-gapped monitoring system, (2) a novel method of metal AM part identification via a low-cost piezoelectric sensor-actuator able to record a part frequency response that is dependent on the geometry and material properties of the part as a whole, (3) an exploration of part-to-part variation across AM processes, again measured via a piezoelectric sensor-actuator, and (4) a novel means of using the same piezoelectric sensor-actuator for detecting the presence of remaining powder in metal AM parts.

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Keywords

Additive Manufacturing, Cyber-Physical Security, In Situ Sensing, Electromechanical Impedance, Identification, Anti-Counterfeiting

Citation