A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material
| dc.contributor.author | Ding, Zikun | en |
| dc.contributor.author | Wang, Zhichao | en |
| dc.contributor.author | Zhang, Bowen | en |
| dc.contributor.author | Lu, Guo-Quan | en |
| dc.contributor.author | Mei, Yun-Hui | en |
| dc.date.accessioned | 2022-05-13T12:19:57Z | en |
| dc.date.available | 2022-05-13T12:19:57Z | en |
| dc.date.issued | 2022-05-09 | en |
| dc.date.updated | 2022-05-12T19:36:19Z | en |
| dc.description.abstract | Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiO<sub>x</sub> paste was proposed by doping 0.1wt% SiO<sub>x</sub> nanoparticles rather than previously used expensive noble metals, e.g., palladium. The ECM lifetime of the sintered nano-Ag-SiO<sub>x</sub> was 1.5 to 3 times longer than that of the sintered nano-Ag, due to the fact that the SiO<sub>x</sub> could protect the Ag from oxidation. The thermo-mechanical reliability of the sintered nano-Ag-SiO<sub>x</sub> was also improved by sintering under 5 MPa assisted pressure. The lesser porosity and smaller grain boundaries of the sintered nano-Ag-SiO<sub>x</sub> could also be beneficial to retard the silver ECM. In the end, a double-sided semiconductor device was demonstrated to validate the better resistance to the ECM using the sintered nano-Ag-SiO<sub>x</sub>. | en |
| dc.description.version | Published version | en |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Ding, Z.; Wang, Z.; Zhang, B.; Lu, G.-Q.; Mei, Y.-H. A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material. Appl. Sci. 2022, 12, 4748. | en |
| dc.identifier.doi | https://doi.org/10.3390/app12094748 | en |
| dc.identifier.uri | http://hdl.handle.net/10919/110075 | en |
| dc.language.iso | en | en |
| dc.publisher | MDPI | en |
| dc.rights | Creative Commons Attribution 4.0 International | en |
| dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | en |
| dc.subject | electrochemical migration | en |
| dc.subject | ionic migration | en |
| dc.subject | sintering | en |
| dc.subject | nanosilver | en |
| dc.subject | doping | en |
| dc.subject | Ag nanoparticles | en |
| dc.subject | reliability | en |
| dc.title | A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material | en |
| dc.title.serial | Applied Sciences | en |
| dc.type | Article - Refereed | en |
| dc.type.dcmitype | Text | en |