Transience of plasma surface modification as an adhesion promoter for polychlorotrifluorethylene

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dc.contributorVirginia Techen
dc.contributor.authorSubrahmanyan, Sumitraen
dc.contributor.authorDillard, John G.en
dc.contributor.authorLove, B. J.en
dc.contributor.authorRomand, M.en
dc.contributor.authorCharbonnier, M.en
dc.contributor.departmentChemistryen
dc.contributor.departmentMaterials Science and Engineeringen
dc.date.accessed2014-05-09en
dc.date.accessioned2014-05-14T13:35:40Zen
dc.date.available2014-05-14T13:35:40Zen
dc.date.issued2002-05-01en
dc.description.abstractPoly (chlorotrifluoroethylene) (PCTFE) and other fluoropolymers are increasingly used as inner layer dielectrics. However, these polymers have low surface energies and correspondingly poor adhesive proper-ties. Results are presented on the use of a low-pressure ammonia plasma to enhance the surface bondability of PCTFE. The plasma modified PCTFE film surfaces were characterized by x-ray photoelectron spectroscopy and contact angle measurements, Surface modified films exhibited improved adhesion to electroless copper deposits (180degrees peel test) compared to coated PCTFE controls and that underwent no plasma exposure. Annealing studies were conducted between 30 and 100 degreesC to examine the stability of the plasma-modified surfaces. For samples annealed below T-g. contact angle measurements indicated that the plasma-introduced groups remained bound on the surface for four weeks. For specimens annealed above Tg, the surface functionalities were absorbed within the bulk and surface rearrangement occurred within 10 h of annealing time. As a result of rearrangement, the benefit of adhesion enhancement by plasma is lost and the adhesion to copper is reduced. (C) 2002 American Vacuum Society.en
dc.identifier.citationSubrahmanyan, S.; Dillard, J. G.; Love, B. J.; Romand, M.; Charbonnier, M., "Transience of plasma surface modification as an adhesion promoter for polychlorotrifluorethylene," J. Vac. Sci. Technol. A 20, 707 (2002); http://dx.doi.org/10.1116/1.1464837en
dc.identifier.doihttps://doi.org/10.1116/1.1464837en
dc.identifier.issn0734-2101en
dc.identifier.urihttp://hdl.handle.net/10919/47991en
dc.identifier.urlhttp://scitation.aip.org/content/avs/journal/jvsta/20/3/10.1116/1.1464837en
dc.language.isoen_USen
dc.publisherAmerican Institute of Physicsen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectNaphthalenide treated fluoropolymersen
dc.subjectCarboxylic-aciden
dc.subjectPolymersen
dc.subjectPoly(tetrafluoroethylene)en
dc.subjectCopperen
dc.subjectPoly(chlorotrifluoroethylene)en
dc.subjectMetallizationen
dc.subjectFilmsen
dc.subjectMaterials science, coatings & filmsen
dc.subjectPhysics, applieden
dc.titleTransience of plasma surface modification as an adhesion promoter for polychlorotrifluorethyleneen
dc.title.serialJournal of Vacuum Science & Technology a-Vacuum Surfaces and Filmsen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten

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