Low-resistance films of polyimides with impregnated copper sulfide

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dc.contributor.authorRowe, R. V. A.en
dc.contributor.authorKunita, M. H.en
dc.contributor.authorPorto, M. F.en
dc.contributor.authorMuniz, E. C.en
dc.contributor.authorRubira, A. F.en
dc.contributor.authorNery, R. C.en
dc.contributor.authorRadovanovic, E.en
dc.contributor.authorTaylor, Larry T.en
dc.contributor.authorNazem, N.en
dc.contributor.departmentChemistryen
dc.date.accessed2014-07-15en
dc.date.accessioned2014-07-21T15:49:39Zen
dc.date.available2014-07-21T15:49:39Zen
dc.date.issued2001-11en
dc.description.abstractSurface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton (R) polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 degreesC for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton (R) composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.en
dc.identifier.citationRowe, R. V. A.; Kunita, M. H.; Porto, M. F.; Muniz, E. C.; Rubira, A. F.; Nery, R. C.; Radovanovic, E.; Taylor, L. T.; Nazem, N., "Low-resistance films of polyimides with impregnated copper sulfide," J. Mater. Res., Vol. 16, No. 11, Nov 2001, 3097-3106. DOI: 10.1557/jmr.2001.0427en
dc.identifier.doihttps://doi.org/10.1557/jmr.2001.0427en
dc.identifier.issn0884-2914en
dc.identifier.urihttp://hdl.handle.net/10919/49638en
dc.identifier.urlhttp://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=7985462&fulltextType=RA&fileId=S0884291400065080en
dc.language.isoen_USen
dc.publisherCambridge University Pressen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectsurface modificationen
dc.subjectmodel compoundsen
dc.subjectsilveren
dc.subjectescaen
dc.subjectcusen
dc.subjectmaterials science, multidisciplinaryen
dc.titleLow-resistance films of polyimides with impregnated copper sulfideen
dc.title.serialJournal of Materials Researchen
dc.typeArticle - Refereeden

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