The influence of interface bonding on thermal transport through solid-liquid interfaces

Simple item page
dc.contributorVirginia Techen
dc.contributor.authorHarikrishna, H.en
dc.contributor.authorDucker, William A.en
dc.contributor.authorHuxtable, Scott T.en
dc.contributor.departmentMechanical Engineeringen
dc.contributor.departmentBiomedical Engineering and Mechanicsen
dc.contributor.departmentChemical Engineeringen
dc.date.accessed2014-01-10en
dc.date.accessioned2014-01-21T19:28:03Zen
dc.date.available2014-01-21T19:28:03Zen
dc.date.issued2013-06-01en
dc.description.abstractWe use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, W-SL, for a series of five alkane-thiol monolayers at the gold-water interface. W-SL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in W-SL, are achieved by varying the terminal group (omega-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60-190 MW m(-2) K-1, and the solid-liquid contact angles span from 25 degrees to 118 degrees. (C) 2013 AIP Publishing LLC.en
dc.description.sponsorshipAir Force Office of Scientific Research FA9550-10-1-0518en
dc.description.sponsorshipVirginia Tech Institute for Critical Technology and Applied Science (ICTAS)en
dc.identifier.citationHarikrishna, Hari; Ducker, William A.; Huxtable, Scott T., "The influence of interface bonding on thermal transport through solid-liquid interfaces," Appl. Phys. Lett. 102, 251606 (2013); http://dx.doi.org/10.1063/1.4812749en
dc.identifier.doihttps://doi.org/10.1063/1.4812749en
dc.identifier.issn0003-6951en
dc.identifier.urihttp://hdl.handle.net/10919/24922en
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/apl/102/25/10.1063/1.4812749en
dc.language.isoen_USen
dc.publisherAIP Publishingen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectHeaten
dc.subjectGolden
dc.subjectPhysicsen
dc.titleThe influence of interface bonding on thermal transport through solid-liquid interfacesen
dc.title.serialApplied Physics Lettersen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten

Files

Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
1.4812749.pdf
Size:
494.31 KB
Format:
Adobe Portable Document Format
Description:
Main article
Download

Collections

Scholarly Works, Biomedical Engineering and Mechanics
Scholarly Works, Chemical Engineering
Scholarly Works, Mechanical Engineering