The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet

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dc.contributor.authorLee, Jaehyunen
dc.contributor.authorEsmaili, Ehsanen
dc.contributor.authorKang, Gihoen
dc.contributor.authorSeong, Baekhoonen
dc.contributor.authorKang, Hosungen
dc.contributor.authorKim, Jihoonen
dc.contributor.authorJung, Sunghwanen
dc.contributor.authorKim, Hyunggunen
dc.contributor.authorByun, Doyoungen
dc.contributor.departmentBiomedical Engineering and Mechanicsen
dc.date.accessioned2021-05-14T13:13:22Zen
dc.date.available2021-05-14T13:13:22Zen
dc.date.issued2021-04-25en
dc.date.updated2021-05-13T14:32:32Zen
dc.description.abstractThe dimple occurs by sudden pressure inversion at the droplet’s bottom interface when a droplet collides with the same liquid-phase or different solid-phase. The air film entrapped inside the dimple is a critical factor affecting the sequential dynamics after coalescence and causing defects like the pinhole. Meanwhile, in the coalescence dynamics of an electrified droplet, the droplet’s bottom interfaces change to a conical shape, and droplet contact the substrate directly without dimple formation. In this work, the mechanism for the dimple’s suppression (interfacial change to conical shape) was studied investigating the effect of electric pressure. The electric stress acting on a droplet interface shows the nonlinear electric pressure adding to the uniform droplet pressure. This electric stress locally deforms the droplet’s bottom interface to a conical shape and consequentially enables it to overcome the air pressure beneath the droplet. The electric pressure, calculated from numerical tracking for interface and electrostatic simulation, was at least <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><msup><mrow><mn>10</mn></mrow><mn>8</mn></msup></mrow></semantics></math></inline-formula> times bigger than the air pressure at the center of the coalescence. This work helps toward understanding the effect of electric stress on droplet coalescence and in the optimization of conditions in solution-based techniques like printing and coating.en
dc.description.versionPublished versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationLee, J.; Esmaili, E.; Kang, G.; Seong, B.; Kang, H.; Kim, J.; Jung, S.; Kim, H.; Byun, D. The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet. Coatings 2021, 11, 503.en
dc.identifier.doihttps://doi.org/10.3390/coatings11050503en
dc.identifier.urihttp://hdl.handle.net/10919/103282en
dc.language.isoenen
dc.publisherMDPIen
dc.rightsCreative Commons Attribution 4.0 Internationalen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.subjectdroplet coalescenceen
dc.subjectspray coatingen
dc.subjectcharged dropleten
dc.subjectpinhole defecten
dc.subjectair film layeren
dc.titleThe Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Dropleten
dc.title.serialCoatingsen
dc.typeArticle - Refereeden
dc.type.dcmitypeTexten
dc.type.dcmitypeStillImageen

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