Browsing by Author "Cvetkovic, Igor"

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    Communication and Control in Power Electronics Systems
    Mitrovic, Vladimir (Virginia Tech, 2021-12-17)
    The demands of a modern way of life have changed the way power electronics systems work. For instance, the grid has to provide not only the service of delivering electrical energy but also the communication to enable interactions between customers and enable them to be producers of electrical energy, too. Thus, the smart grid has come into existence. The consequence of the smart grid is that consumers could be “smart.” The most obvious consumers are households, so the houses have to also be smart and must be equipped with various power electronics devices for producing and managing electrical energy. Again, all those devices have to communicate somehow and provide data for managing electrical energy in the house. Zoomed in further, novel, state-of-the-art measurement equipment could have been built from different power electronics devices, and communication among them would be necessary for good operation. Zoomed further in, communication among different pieces of power electronics devices (such as converters) could offer benefits such as flexibility, abstraction, and modularity. This thesis provides insight into different communication techniques and protocols used in power electronics systems. A top-down approach presents three different levels of communication used in real-life projects with all the challenges they bring, starting with the smart house, followed by the state-of-the-art impedance measurement unit, and finalizing with internal power electronics building block (PEBB) communication. In the case of a smart house, where the house is equipped with solar panels, charge controllers, batteries, and inverters, communication allows interoperation between different elements of the power electronics system, enabling energy management. Results show the operation of the system and energy management algorithm. A house of this type won first prize at an international competition where energy management was one of the disciplines. The impedance measurement unit consists of different power electronics devices. In this case, too, communication between devices enables the operation of the impedance measurement unit. Communication techniques used here are shown together with measurement results. Finally, inter-PEBB communication has been shown as an approach for interaction among the different elements inside the PEBB, such as controller, GDs, sensors, and actuators. Real-time communication protocol, including all challenges, is described and developed. This approach is shown to enable communication and synchronization among different nodes inside the PEBB. Communication enables all internal elements of the PEBB to be transparent outside the PEBB in the sense that data gathered from them could be reused anywhere else in the system. Also, this approach enables the development of distributed event (time) driven control, hardware and software, abstraction, high modularity, and flexibility. A very important aspect of inter-PEBB communication is synchronization. A simple technique of sharing a clock among the parts of a 6 kV PEBB has been shown.
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    Design and Testing of a SiC-based Solid-State Bypass Switch for 1 kV Power Electronics Building Blocks
    Mutyala, Sri Naga Vinay (Virginia Tech, 2021-09-24)
    Over the past two decades, power consumption has increased exponentially worldwide, posing new challenges to power grids to meet the load requirements. With this growing power demand, the need for efficient high-density medium-voltage (MV) power converters has increased to support flexible power distribution grids. The modular multilevel converters (MMC) became the most typical MV power converters in applications from 2010. This topology has many advantages, such as voltage scalability, excellent output performance, and low voltage ratings for switching devices. However, without the excellent reliability of the MMC, applications cannot reap these benefits. The MMC topology comprises several series-connected submodules (typically a half-bridge or a full-bridge inverter). As a result of increased switching devices, the converter becomes vulnerable since a single device fault can disrupt the whole converter operation. Therefore, fault-tolerant strategies to replace faulty SM with a redundant SM are developed using additional bypass switches. Conventionally TRIACs and vacuum switches are employed as bypass switches that operate in the range of 2-10 microseconds. Despite having performance advantages, MMCs are still not fully employed in aerospace and naval industries due to their enormous size. Many Power Electronics Building Blocks (PEBB) are proposed, with size optimization, as submodules for modular converters. The PEBB1000, a 1000 V- PEBB proposed by Dr. Jun Wang, achieved a significant size reduction of 80% with a novel switching cycle control (SCC) scheme. This novel control scheme requires high switching frequency and high di/dt-currents for MMC operation. Due to di/dt-rate limitations, TRIAC-based switch cannot perform bypass operation. Therefore, research work has been conducted on bypass switches for PEBB1000 using wide-bandgap SiC devices. This thesis presents the design of a SiC MOSFET-based bypass switch for PEBB1000 in MMC application. A detailed fault case analysis is presented to show the feasibility of the bypass operation for 90% PEBB-level faults. Significant variations in PEBB1000 bypass requirements are observed through SCC-based MMC simulations. Accordingly, a 1700 V, 100 A bypass switch has been designed using the anti-series topology of MOSFETs. Various specifications, such as 142 nanoseconds operation time, 500 nanoseconds bypass commutation time, and 277A transient current conduction capability, are validated through practical tests. Results prove that SiC-MOSFETs work better than TRIACs in high di/dt-current conduction and operation times. For future work, false-triggering endurance has to be analyzed for 1000 V switching voltage.
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    Design of 1.7 kV SiC MOSFET Switching-Cells for Integrated Power Electronics Building Block (iPEBB)
    Rajagopal, Narayanan (Virginia Tech, 2021)
    The need for high-density power electronics converters becomes more critical by the day as energy consumption continues to grow across the world. Specifically, the need for medium-voltage (MV) high-density converters in power distribution systems, electric ships, and airplanes become more critical as weight and space becomes more a premium. The limited space and footprint require new packaging technologies and methods to develop an integrated power converter. The advancement of wide-bandgap (WBG) devices like silicon carbide (SiC) allows converters to have higher power and faster switching... To benefit from these devices, the packaging of the converter needs to be carefully considered. This thesis presents the design of a 250 kW integrated power electronics building block (iPEBB) for future electric system applications. This work explores the common substrate concept that would serve as the electrical, thermal, and mechanical foundation for the converter. State-of-the-art organic direct-bonded copper (ODBC) is explored to serve as the material foundation for the common substrate. Multi-domain simulations are used to design the integrated SiC bridges to achieve a power loop inductance of 3.5 nH, a maximum temperature of 175 °C, and a weight of 16 kg. ODBC and silicon nitride switching cells are packaged and analyzed in order to see the benefits on a multi-layer design as well as determining electrical and thermal trade-offs. The insights gained from hardware testing will help in the redesign and refinement of the iPEBB.
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    Design of a 10 kV SiC MOSFET-based high-density, high-efficiency, modular medium-voltage power converter
    Mocevic, Slavko; Yu, Jianghui; Fan, Boran; Sun, Keyao; Xu, Yue; Stewart, Joshua; Rong, Yu; Song, He; Mitrovic, Vladimir; Yan, Ning; Wang, Jun; Cvetkovic, Igor; Burgos, Rolando; Boroyevich, Dushan; DiMarino, Christina; Dong, Dong; Motwani, Jayesh Kumar; Zhang, Richard (IEEE, 2022-03)
    Simultaneously imposed challenges of high-voltage insulation, high dv/dt, high-switching frequency, fast protection, and thermal management associated with the adoption of 10 kV SiC MOSFET, often pose nearly insurmountable barriers to potential users, undoubtedly hindering their penetration in medium-voltage (MV) power conversion. Key novel technologies such as enhanced gatedriver, auxiliary power supply network, PCB planar dc-bus, and high-density inductor are presented, enabling the SiC-based designs in modular MV converters, overcoming aforementioned challenges. However, purely substituting SiC design instead of Sibased ones in modular MV converters, would expectedly yield only limited gains. Therefore, to further elevate SiC-based designs, novel high-bandwidth control strategies such as switching-cycle control (SCC) and integrated capacitor-blocked transistor (ICBT), as well as high-performance/high-bandwidth communication network are developed. All these technologies combined, overcome barriers posed by state-of-the-art Si designs and unlock system level benefits such as very high power density, high-efficiency, fast dynamic response, unrestricted line frequency operation, and improved power quality, all demonstrated throughout this paper.
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    Design of a 405/430 kHz, 100 kW Transformer with Medium Voltage Insulation Sheets
    Sharfeldden, Sharifa (Virginia Tech, 2023-07-27)
    To achieve higher power density, converters and components must be able to handle higher voltage and current ratings at higher percentages of efficiency while also maintaining low cost and a compact footprint. To meet such demands, medium-voltage resonant converters have been favored by researchers for their ability to operate at higher switching frequencies. High frequency (HF) operation enables soft switching which, when achieved, reduces switching losses via either zero voltage switching (ZVS) or zero current switching (ZCS) depending on the converter topology. In addition to lower switching losses, the converter operates with low harmonic waveforms which produce less EMI compared to their hard switching counterparts. Finally, these resonant converters can be more compact because higher switching frequencies imply decreased volume of passive components. The passive component which benefits the most from this increased switching frequency is the transformer. The objective of this work is to design a >400 kHz, 100 kW transformer which will provide galvanic isolation in a Solid-State Transformer (SST) based PEBBs while maintaining high efficiency, high power density, and reduced size. This work aims to present a simplified design process for high frequency transformers, highlighting the trade-offs between co-dependent resonant converter and transformer parameters and how to balance them during the design process. This work will also demonstrate a novel high frequency transformer insulation design to achieve a partial discharge inception voltage (PDIV) of >10 kV.
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    Global Intergrid for Sustainable Energy Abundance
    Boroyevich, Dushan; Cvetkovic, Igor; Dong, Dong (IEEE Power Electronics Society, 2022-06-04)
    Invited Poster for Session on Brainstorming for Game-Changing Ideas.
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    Modeling and Control of Voltage-Controlling Converters for Enhanced Operation of Multi-Source Power Systems
    Cvetkovic, Igor (Virginia Tech, 2018-11-14)
    The unconventional improvements in the power electronics field have been the primary reason for massive deployment of renewable energy sources in the electrical power grid over the past several decades. This needed trend, together with the increasing penetration of micro-, and nano- grids, is bringing significant improvements in system controllability, performance, and energy availability, but is fundamentally changing the nature of electronically-interfaced sources and loads, altering their conventionally mild aggregate dynamics, and inflicting low- and high- frequency dynamic interactions that never before existed at this magnitude. This problem is not restricted only to the grid; modern electronic power distribution systems built for airplanes, ships, electric vehicles, data-centers, and homes, comprise dozens, even hundreds of power electronics converters, produced by different manufacturers, who provide very limited details on converters' dynamic behavior - distinctiveness that has the highest impact on how two converters, or converter and a system interact. Consequently, substantial dispersion of power electronics into the future grid will significantly depend on engineers' capability to understand how to model and dynamically control power flow and subsystem interactions. It is therefore essential to continue developing innovative methods that allow easier system-level modeling, continuous monitoring of dynamic interactions, and advanced control concepts of power electronics converters and systems. The dissertation will start with a "black box" approach to modeling of three-phase power electronics converters, introducing a method to remove source and load dynamics from in-situ measured terminated frequency responses. It will be then shown how converter, itself, can perform an online stability assessment knowing its own unterminated dynamics, and being able to measure all terminal immittances. The dissertation will further advance into an approach to control power electronics converters based on the electro-mechanical duality with synchronous machines, and end with selected examples of system-level operation, where small-signal instability in multi-source power systems can be mitigated using this concept.
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    Modeling, Analysis and Design of Renewable Energy Nanogrid Systems
    Cvetkovic, Igor (Virginia Tech, 2010-07-22)
    The thesis addresses electronic power distribution systems for the residential applications. Presented are both, renewable energy ac-nanogrid system along with the vehicle-to-grid technology implementation, and envisioned structure and operation of dc-nanogrid addressing all system components chosen as an inherent part of the future electrical architecture. The large-scale model is built and tested in the laboratory environment covering a few operational modes of the ac-nanogrid, while later in the thesis is shown how dc bus signaling technique could be contemplated for the energy management of the renewable energy sources and their maximal utilization. Thesis however puts more focus on the dc-nanogrid system to explore its benefits and advantages for the electrical systems of the future homes that can easily impact not only residential, but also microgrid, grid and intergrid levels. Thus, presented is low frequency terminal behavioral modeling of the system components in dc-nanogrid motivated by the fact that system engineers working on the system-level design rarely have access to all the information required to model converters and system components, other than specification and data given in the datasheets. Using terminal behavioral modeling, converters are measured on-line and their low frequency dynamics is identified by the means of the four transfer functions characteristically used in two port network models. This approach could significantly improve system-level design and simulations. In addition to previously mentioned, thesis addresses terminal behavioral modeling of dc-dc converters with non-linear static behavior showing hybrid behavioral models based on the Hammerstein approach.
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    PCB-Based 1.2 kV SiC MOSFET Packages for High Power Density Electric Vehicle On-Board Chargers
    Knoll, Jack (Virginia Tech, 2022)
    Global energy consumption continues to grow, driving the need for cheap, power-dense power electronics. Replacing the incumbent silicon insulated gate bipolar transistors with silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) has been proposed as a solution to increase the power densities of power converters in some applications. One such application is electric vehicles (EVs) where the efficiency and weight of the power electronics are critical; however, modern packaging technologies are still limiting the performance of SiC MOSFETs. One promising trend in power semiconductor packaging technologies is the use of printed circuit boards (PCBs) because the technology is mature—resulting in low costs—and the allowable stackups are ideal for integrating driving circuitry and power loop components—resulting in reduced manufacturing complexity. This thesis presents the design and analysis of two PCB-embedded 1.2 kV SiC MOSFET half-bridge packages and a hybrid PCB/DBC-based 1.2 kV SiC MOSFET full-bridge package for EV on-board charger applications. The first of the two PCB-embedded packages has integrated gate drive circuitry, less than 2.3 nH loop inductances, and dual-sided cooling with a total junction-to-case thermal resistance (RTH,JC) of 0.12 K/W. The second PCB-embedded package has only drain-side cooling to allow for surface mount terminals, has an area of 37.1 mm x 18.5 mm due to the removal of the gate drive circuitry, and has less than 2.4 nH loop inductances. The PCB/DBC-based full-bridge package has an RTH,JC of 0.65 K/W, less than 4.5 nH, and integrated gate drive circuitry.
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    Reliability Evaluation of Large-Area Sintered Direct Bonded Aluminum Substrates for Medium-Voltage Power Modules
    Gersh, Jacob Daniel (Virginia Tech, 2021-06-16)
    This thesis investigates techniques for prototyping and evaluation of medium voltage (MV) power module packages. Specific focus will be given to the utilization of silver sintering as a bonding method for high temperature, high density power modules. Nano-silver paste and preform will be examined in detail as enabling technologies for a new generation of power electronics. To accomplish this task, analysis and characterization of the metal-ceramic substrate and its structure is performed. First, finite element models are created to evaluate the fatigue behavior of the large area bonds in the substrate structure. Prototypes of these multi-layer substrates have also been fabricated and will be subjected to thermal cycling tests for experimental verification of the efficacy of their sintered silver bonds. Stacked direct-bonded aluminum (DBA) substrates have been found to withstand up to 1000 thermal cycles of –40 °C to 200 °C when attached with low pressure-assisted silver sintering. The thermal performance of 10 kV SiC power module utilizing multi-layer DBA substrates bonded with a large-area, low pressure-assisted sintered silver bond will also be examined to ensure the sintered bond is viable for the harsh operating conditions of MV modules. A junction-to-case thermal resistance of 0.142 °C/W is measured on a module prototype utilizing stacked DBA substrates. Finally, analysis of a double-sided cooling scheme enabled by large area sintering is simulated and prototyped to demonstrate a 6.5 kV package for a MV power device. Residual stress failures induced by a highly rigid structure have been examined and mitigated through implementation of a 5 MPa pressure-assisted, double-sided silver sintering approach.
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    Terminal Behavioral Modeling of Electric Machines for Real-time Emulation and System-level Analysis
    Nazari, Arash (Virginia Tech, 2022-09-20)
    Stability and sustainability of operation of interconnected power converter systems has been an important focus of study in the field of power electronics and power systems. With ever-increasing application of electrical machines by means of electrification of vehicles, airplanes and shipboards, detailed study of the relating dynamics is very important to ensure the proper implementation and stable behavior of the overall system. In this work, the application of the black box approach study of the power converters has been expanded to the electrical machines. Using this modeling method, it is possible of have accurate behavior of electrical and mechanical terminals of the machine without the detailed information about the internal structure of the machine, material characteristics or topology of the machine. Instead, accurate model of electrical and mechanical terminals of the machine are achieved by measuring specific frequency responses of the machine to distinguish dynamic relation of the various electrical and mechanical quantities of the machine. The directly measured frequency responses, are coupled with the dynamics of the source and load in the electrical and mechanical terminals of the machine thus in order to decoupled the described couplings a mathematical process is used that results in decoupling of the controller and drive on the electrical side and the dynamics of the mechanical load and mechanical shaft at the mechanical terminal of the machine. Resulting model is the linear time invariant representation of the electrical machine at a specific operating point. Additionally, this work represents the application of this modeling method for accurate measurement of internal parameters of the machine such as inductances and mechanical inertia and characterization of the mechanical shaft coupler. Resulting unterminated model of the machine is a very important matter of information for system integrators and electrical and mechanical designs related to the application of the machine, to ensure the stable and sustainable operation of the machine. This work for the first time, represents the experimental implementation of this terminal behavioral modeling method for studying electrical machines as well as describes some of the practical limitations of this methodology. By incorporating and integrating a combination of commercially available devices such as frequency response analyzer, Hardware-In-The-Loop (HIL), Power-Hardware-In-The-Loop (PHIL), a test setup has been developed that is capable of control, operate and study arbitrary frame small-signal related measurements required for terminal behavioral study of the electrical machines. Resulting model of the machine that has been extracted from this modeling method is then used to compare in time domain with the real machine in the case of transient change in the mechanical load on the shaft to discover the validity of this modeling procedure.