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dc.contributorVirginia Techen_US
dc.contributor.authorHarikrishna, H.en_US
dc.contributor.authorDucker, William A.en_US
dc.contributor.authorHuxtable, S. T.en_US
dc.date.accessioned2014-01-21T19:28:03Z
dc.date.available2014-01-21T19:28:03Z
dc.date.issued2013-06-01
dc.identifier.citationHarikrishna, Hari; Ducker, William A.; Huxtable, Scott T., "The influence of interface bonding on thermal transport through solid-liquid interfaces," Appl. Phys. Lett. 102, 251606 (2013); http://dx.doi.org/10.1063/1.4812749
dc.identifier.issn0003-6951
dc.identifier.urihttp://hdl.handle.net/10919/24922
dc.description.abstractWe use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, W-SL, for a series of five alkane-thiol monolayers at the gold-water interface. W-SL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in W-SL, are achieved by varying the terminal group (omega-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60-190 MW m(-2) K-1, and the solid-liquid contact angles span from 25 degrees to 118 degrees. (C) 2013 AIP Publishing LLC.
dc.description.sponsorshipAir Force Office of Scientific Research FA9550-10-1-0518
dc.description.sponsorshipVirginia Tech Institute for Critical Technology and Applied Science (ICTAS)
dc.language.isoen_US
dc.publisherAIP Publishing
dc.subjectHeaten_US
dc.subjectGolden_US
dc.subjectPhysicsen_US
dc.titleThe influence of interface bonding on thermal transport through solid-liquid interfacesen_US
dc.typeArticleen_US
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/apl/102/25/10.1063/1.4812749
dc.date.accessed2014-01-10
dc.title.serialApplied Physics Letters
dc.identifier.doihttps://doi.org/10.1063/1.4812749
dc.type.dcmitypeTexten_US


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