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dc.contributor.authorSubbaraman, Ganesanen
dc.date.accessioned2017-01-10T20:35:02Zen
dc.date.available2017-01-10T20:35:02Zen
dc.date.issued1974en
dc.identifier.urihttp://hdl.handle.net/10919/74118en
dc.description.abstractStudy of prolonged diffusion in Cu-Au and Cu-Pd systems has revealed that the diffusion generated misorientations tend to mend themselves because of reduced concentration gradients. Previous studies of the Cu-Ni system in which a 8.0 micron nickel plated single crystal copper was diffused up to 5 hours at 900°C, did not reveal such features. It was desirable to obtain more information on the structure oriented diffusion of this system at prolonged diffusion times. For this purpose a 3.0 micron nickel plated copper single crystal was subjected to diffusion anneals at 900°C for times as long as 7 hours. The diffusion and structure data were obtained by the nondestructive X-ray method with supporting measurements using a Scanning Electron Microscope and computer simulations. It has been found that the diffusion behavior is dynamic and is influenced by structure. At lower times a unified grain boundary-volume diffusion model is able to account for the diffusion behavior whereas at intermediate and higher times a volume diffusion model with anomalously varying range of pseudo diffusion coefficients is required to match the experimental intensity patterns. Scanning Electron Microscope studies made at the end of the six different anneals show extensive flow patterns and porosities indicative of structural modifications. Rocking curve measurements obtained at chosen compositions over the treatments indicate no tendency of reorientation of the structure; the variance and halfwidth analysis demonstrate this feature. In fact, strong indications of the structure, having undergone a recrystallization are revealed at the end of the last diffusion anneal.en
dc.format.extentviii, 133 leavesen
dc.format.mimetypeapplication/pdfen
dc.language.isoen_USen
dc.publisherVirginia Polytechnic Institute and State Universityen
dc.relation.isformatofOCLC# 38995111en
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subject.lccLD5655.V855 1974.S9en
dc.titleStudy of diffusion damage in the copper-nickel systemen
dc.typeThesisen
dc.contributor.departmentMetallurgical Engineeringen
dc.description.degreeMaster of Scienceen
thesis.degree.nameMaster of Scienceen
thesis.degree.levelmastersen
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen
thesis.degree.disciplineMetallurgical Engineeringen
dc.type.dcmitypeTexten


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