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Electromagnetic Modeling of Packaging Layout in Power Electronic Modules

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dc.contributor.authorSiddabattula, Kalyan C.en
dc.contributor.committeechairBoroyevich, Dushanen
dc.contributor.committeememberLu, Guo-Quanen
dc.contributor.committeememberLee, Fred C.en
dc.contributor.departmentElectrical and Computer Engineeringen
dc.date.accessioned2014-03-14T20:49:29Zen
dc.date.adate2000-01-06en
dc.date.available2014-03-14T20:49:29Zen
dc.date.issued1999-12-03en
dc.date.rdate2001-01-06en
dc.date.sdate1999-12-13en
dc.description.abstractThis thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond technology, (ii) The Metal Post Interconnected Parallel Plate Structure, and the (iii) Multi Layer Structure. The model developed is validated through experimentation. These models are then used in simulation in order to compare the electrical performance of the packaging technologies. Finally some problems with the existing designs are pointed out, and suggestions (both local and generic) are given to improve the layout design.en
dc.description.degreeMaster of Scienceen
dc.identifier.otheretd-121399-153938en
dc.identifier.sourceurlhttp://scholar.lib.vt.edu/theses/available/etd-121399-153938/en
dc.identifier.urihttp://hdl.handle.net/10919/36110en
dc.publisherVirginia Techen
dc.relation.haspartSiddabattula_ETD.pdfen
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subjectPackagingen
dc.subjectModelingen
dc.titleElectromagnetic Modeling of Packaging Layout in Power Electronic Modulesen
dc.typeThesisen
thesis.degree.disciplineElectrical and Computer Engineeringen
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen
thesis.degree.levelmastersen
thesis.degree.nameMaster of Scienceen

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