Modeling and simulation of surface mount packages

dc.contributor.authorPerdue, James Patricken
dc.contributor.departmentElectrical Engineeringen
dc.date.accessioned2014-03-14T21:40:15Zen
dc.date.adate2009-07-11en
dc.date.available2014-03-14T21:40:15Zen
dc.date.issued1994en
dc.date.rdate2009-07-11en
dc.date.sdate2009-07-11en
dc.description.abstractThe objective of this thesis is to develop an understanding and performance evaluation of plastic packages for surface mount devices. Of particular interest in this work are packages for use in the gigahertz range. In order to accurately model these packages, time and frequency domain measurements of two different packaged structures are performed. Equivalent electrical circuit models for the structures are then derived and compared with measured results to determine quality of fit and validity of these models. With this modeling technique, various package parasitics affecting the circuit performance can be evaluated and compensated for in the electrical equivalent models.en
dc.description.degreeMaster of Scienceen
dc.format.extentv, 40 leavesen
dc.format.mediumBTDen
dc.format.mimetypeapplication/pdfen
dc.identifier.otheretd-07112009-040410en
dc.identifier.sourceurlhttp://scholar.lib.vt.edu/theses/available/etd-07112009-040410/en
dc.identifier.urihttp://hdl.handle.net/10919/43678en
dc.language.isoenen
dc.publisherVirginia Techen
dc.relation.haspartLD5655.V855_1994.P473.pdfen
dc.relation.isformatofOCLC# 42268904en
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subject.lccLD5655.V855 1994.P473en
dc.titleModeling and simulation of surface mount packagesen
dc.typeThesisen
dc.type.dcmitypeTexten
thesis.degree.disciplineElectrical Engineeringen
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen
thesis.degree.levelmastersen
thesis.degree.nameMaster of Scienceen

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