Quantitative evaluation of thin film adhesion using the probe test
| dc.contributor.author | Chadha, Harpreet Singh | en |
| dc.contributor.committeechair | Dillard, David A. | en |
| dc.contributor.committeemember | Librescu, Liviu | en |
| dc.contributor.committeemember | Dillard, John G. | en |
| dc.contributor.department | Engineering Science and Mechanics | en |
| dc.date.accessioned | 2014-03-14T20:46:48Z | en |
| dc.date.adate | 2006-10-26 | en |
| dc.date.available | 2014-03-14T20:46:48Z | en |
| dc.date.issued | 2006-08-04 | en |
| dc.date.rdate | 2006-10-26 | en |
| dc.date.sdate | 2006-10-18 | en |
| dc.description.abstract | In this study, a test technique, referred to as the probe test, has been developed as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film microelectronic coatings. In the probe test method, an inclined needle-like probe with a conical tip is advanced underneath the free edge of a thin polymeric coating bonded to a substrate, causing the edge to lift-up from the surface of the substrate. A debond is thus initiated at the loading point and propagates as a semi-circular crack at the interface as the probe slides under the coating. A standard test procedure has been developed for testing thin adhesive coating/substrate systems. The sample system used is a thin film epoxy polymer coated silicon system. The interfacial fracture energy (Gc) (or critical strain energy release rate) has been used as a quantitative measure of adhesion for the given adhesive coating/substrate system. The probe test experiments were conducted using an optical microscope and a WYKO optical profiler. Using the optical microscope, the debond radius was measured for different debond sizes. Using the WYKO optical profiler, the three-dimensional surface topography of the debonded coating around the crack front was measured for different debond sizes. Using the experimental data from the probe test, analytical and numerical (finite element-based) techniques have been developed to determine the interfacial fracture energy (Gc) for the given adhesive coating/substrate system. The analytical techniques were developed based on different plate theory formulations (thin/thick plate - small/large deflection) of the probe test geometry and local curvature measurement at the crack tip. The finite element based techniques were developed using a hybrid numerical-experimental approach and surface-based contact interaction analysis in ABAQUS. The results obtained using thick plate-large deflection formulation correlated with finite element contact interaction analysis results. The probe test can be used with transparent or opaque coatings and thus offers a promising alternative to indentation and other tests methods for characterizing thin film and coating adhesion. | en |
| dc.description.degree | Master of Science | en |
| dc.identifier.other | etd-10182006-081706 | en |
| dc.identifier.sourceurl | http://scholar.lib.vt.edu/theses/available/etd-10182006-081706/ | en |
| dc.identifier.uri | http://hdl.handle.net/10919/35426 | en |
| dc.publisher | Virginia Tech | en |
| dc.relation.haspart | Thesis.pdf | en |
| dc.rights | In Copyright | en |
| dc.rights.uri | http://rightsstatements.org/vocab/InC/1.0/ | en |
| dc.subject | interfacial fracture energy | en |
| dc.subject | fracture mechanics | en |
| dc.subject | thin film | en |
| dc.subject | adhesion | en |
| dc.subject | delamination | en |
| dc.title | Quantitative evaluation of thin film adhesion using the probe test | en |
| dc.type | Thesis | en |
| thesis.degree.discipline | Engineering Science and Mechanics | en |
| thesis.degree.grantor | Virginia Polytechnic Institute and State University | en |
| thesis.degree.level | masters | en |
| thesis.degree.name | Master of Science | en |
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