Characterization of Proton and Sulfur Implanted GaSb Photovoltaics and Materials

III-V compound Gallium Antimonide (GaSb), with a low bandgap of 0.72 eV at room temperature, is an attractive candidate for a variety of potential applications in optoelectronic devices. Ion implantation, among non-epitaxial methods, is a common and reliable doping technique to achieve local doping and obtain high-performance ohmic contacts in order to form a pn junction in such devices. An advantage of this technique over the diffusion method is the ability to perform a low-temperature process leading to accurate control of the dopant profile and avoiding Sb evaporation from GaSb surface occurring at 370 C.

In this work, the effect of protons and sulfur ions as two implant species on the electrical behavior of MBE-grown undoped GaSb on semi-insulating (SI) GaAs was investigated via the Hall Effect. Protons and sulfur ions were implanted at room temperature (27 C) and 200 C, respectively, and rapid thermal annealing (RTA) was implemented at various temperatures and durations upon encapsulated GaSb. The damage induced by protons enhanced the hole density of GaSb up to around 10 times, whereas mobilities showed both increase and decrease compared to the un-implanted one, depending on the dose. While the activation of sulfur donors at an elevated temperature was anticipated after annealing sulfur implanted GaSb, instead it led to increase in p-type concentration, as the residual damage originated from sulfur implantation dominated substitutional doping.

Furthermore, GaSb p/n photovoltaic devices were fabricated by applying sulfur implantation through silicon nitride layer at RT into an n-GaSb wafer (n-type base, p-type emitter). The device showed a rectifying current and photovoltaic characteristic. The J-V plot under AM1.5G illumination conditions, before and after an etch-back optimizing process, indicated lower short circuit current density J_sc, the same open circuit voltage V_oc, and higher fill factor FF, compared to the photovoltaic device with a p-type base. Also, both normalized series R_s and shunt R_p resistances in p/n diode indicated lower and higher values, respectively, as opposed to a GaSb p++/p diode, indicative of higher quality and lower manufacturing defects.