Poly(amide acid) infusion with Copper(II) Chloride to form polyimide microcomposite films

dc.contributor.authorWitsch, James Michaelen
dc.contributor.committeechairTaylor, Larry T.en
dc.contributor.committeememberDillard, John G.en
dc.contributor.committeememberMarand, Hervé L.en
dc.contributor.departmentChemistryen
dc.date.accessioned2014-03-14T20:44:23Zen
dc.date.adate2003-08-28en
dc.date.available2014-03-14T20:44:23Zen
dc.date.issued1992en
dc.date.rdate2003-08-28en
dc.date.sdate2003-08-28en
dc.description.abstractPolyimides are well known for their high thermal stability, chemical inertness, and their high electrical resistance. These properties make them ideal for use in the aerospace and electronics industries. Often polyimides are modified by coating or doping the films with metal species to change the surface or bulk properties of the polyimide. Usually this is done to create an electrically conductive surface layer. Previously, surface layers of metal and/or metal oxide on polyimide films have been made by homogeneously doping a poly(amide acid) solution with a metal complex and then thermally curing to 300°C. However, much of the dopant remains in the bulk of the films. Depending on the nature of the metal salt or complex, it has been postulated that lower polymer decomposition temperatures result if residual dopant remains in the bulk of the polymer. Deposition by infusion of the metal salt or complex was proposed as an alternative method for developing surface layers on polyimide films. The infusion processes attempted and the resulting films will be described and discussed.en
dc.description.degreeMaster of Scienceen
dc.format.extentxii, 110 leavesen
dc.format.mediumBTDen
dc.format.mimetypeapplication/pdfen
dc.identifier.otheretd-08282003-155405en
dc.identifier.sourceurlhttp://scholar.lib.vt.edu/theses/available/etd-08282003-155405/en
dc.identifier.urihttp://hdl.handle.net/10919/34822en
dc.language.isoenen
dc.publisherVirginia Techen
dc.relation.haspartwitsch.pdfen
dc.relation.isformatofOCLC# 26487450en
dc.rightsIn Copyrighten
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/en
dc.subject.lccLD5655.V855 1992.W577en
dc.subject.lcshPolyimidesen
dc.subject.lcshPolymers -- Electric propertiesen
dc.titlePoly(amide acid) infusion with Copper(II) Chloride to form polyimide microcomposite filmsen
dc.typeThesisen
dc.type.dcmitypeTexten
thesis.degree.disciplineChemistryen
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen
thesis.degree.levelmastersen
thesis.degree.nameMaster of Scienceen

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